Coil component
The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a low-cost coil component having a low direct-current resistance. A common mode filter includes a bridge conductor layer which has a bridge conductor one end of which is connected to one end of a lead wire and another end of which is connected to an inner circumferential end of a coil conductor and another bridge conductor one end of which is connected to one end of another lead wire and another end of which is connected to an inner circumferential end of another coil conductor, the bridge conductor layer being formed between two coil conductor layers with an insulation film interposed between the bridge conductor layer and each of the coil conductor layers.
1. A coil component comprising:
a first coil conductor layer having first and second electrode terminals, a first lead-out conductor one end of which is connected to the first electrode terminal, and a first coil conductor connected to the second electrode terminal at an outer circumferential end thereof;
a second coil conductor layer having third and fourth electrode terminals, a second lead-out conductor one end of which is connected to the third electrode terminal, and a second coil conductor connected to the fourth electrode terminal at an outer circumferential end thereof, the second coil conductor layer being disposed opposite to the first coil conductor layer; and
a bridge conductor layer having a first bridge conductor one end of which is connected to another end of the first lead-out conductor and another end of which is connected to an inner circumferential end of the first coil conductor and a second bridge conductor one end of which is connected to another end of the second lead-out conductor and another end of which is connected to an inner circumferential end of the second coil conductor, the bridge conductor layer being formed between the first and second coil conductor layers with insulation films disposed between the bridge conductor layer and the first and second coil conductor layers.
2. A coil component according to claim 1 , wherein a thickness of the first and second lead-out conductors is greater than a thickness of the first and second bridge conductors.
3. A coil component according to claim 1 , wherein the first and second bridge conductors are not exposed on side surfaces of the insulation films.