Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component
The invention proposes a housing for at least two radiation-emitting components, particularly LEDs, comprising a system carrier ( 1 ) and a reflector arrangement ( 2 ) disposed on said system carrier ( 1 ), the reflector arrangement comprising a number of reflectors each of which serves to receive at least one radiation-emitting component and which are fastened to one another by means of a holding device ( 4 ).
1. A housing for at least two radiation-emitting components, comprising a system carrier and a reflector arrangement disposed on said system carrier, said reflector arrangement comprising a number of reflector elements each of which serves to receive at least one radiation-emitting component and which are fastened to one another by means of a holding device fabricated separately from said reflector arrangement, wherein said system carrier and said holding device are made of a first material having a first thermal expansion coefficient and said reflector arrangement of a second material having a second thermal expansion coefficient.
2. The housing as in claim 1 , wherein
the material of said system carrier and the material of said holding device have similar or identical thermal expansion coefficients.
3. The housing as in claim 1 , wherein said first material is a metal, a ceramic or a semiconductor.
4. The housing as in claim 1 , wherein said second material is a plastic.
5. The housing as in claim 1 , wherein said holding device functions as a leadframe for said radiation-emitting components.
6. A housing for at least two radiation-emitting components, comprising a system carrier and a reflector arrangement disposed on said system carrier, said reflector arrangement comprising a number of reflector elements each of which serves to receive at least one radiation-emitting component and which are fastened to one another by means of a holding device fabricated separately from said reflector arrangement, wherein said holding device comprises at least two recesses in each of which at least one reflector element is formed, onto said holding device.
7. The housing as in claim 6 , wherein exactly one reflector element is formed in each recess.
8. The housing as in claim 1 , wherein said holding device includes electrical leads that can be used for the electrical connection of said radiation-emitting components.
9. A housing for at least two radiation-emitting components, comprising a system carrier and a reflector arrangement disposed on said system carrier, said reflector arrangement comprising a number of reflector elements each of which serves to receive at least one radiation-emitting component and which are fastened to one another by means of a holding device fabricated separately from said reflector arrangement, wherein said holding device comprises a mounting frame by means of which said holding device, carrying said reflector arrangement, can be mounted on said system carrier.
10. The housing as in claim 9 , wherein said mounting frame is arranged surroundingly around said reflector arrangement and is connected to said system carrier.
11. The housing as in claim 10 , wherein-the space formed between said mounting frame, said system carrier and said holding device is filled with a potting compound.
12. The housing as in claim 1 ,
wherein-said holding device comprises terminal strips that can be used as surface-mountable contacts.
13. A radiation-emitting component, comprising at least two LEDs, wherein it comprises a housing according to claim 1 .
14. The radiation-emitting component as in claim 13 , wherein said LEDs are mounted on said system carrier.
15. A method of making a housing for a radiation-emitting component, wherein a number of reflector elements are formed onto a holding device made of a first material, adjacent reflectors being connected mechanically via said holding device, and said holding device, provided with said reflectors, is disposed on and fastened to a system carrier, wherein said system carrier and said holding device are made of a first material having a first thermal expansion coefficient and said reflector arrangement of a second material having a second thermal expansion coefficient.
16. The method as in claim 15 , wherein said holding device is provided with recesses in which said reflector elements are formed on.
17. A method of making a housing for a radiation-emitting component as in claim 1 , wherein a number of reflector elements are formed onto a holding device made of a first material, adjacent reflectors being connected mechanically via said holding device, and said holding device, provided with said reflectors, is disposed on and fastened to a system carrier, wherein said reflector elements are formed onto said holding device by means of an injection molding or transfer molding process.
18. A method of making a housing for a radiation-emitting component as in claim 1 , wherein a number of reflector elements are formed onto a holding device made of a first material, adjacent reflectors being connected mechanically via said holding device, and said holding device, provided with said reflectors, is disposed on and fastened to a system carrier, wherein the connection of said holding device to said system carrier is effected via a mounting frame.
19. The housing as in claim 1 , wherein the two radiation-emitting components are LEDs.