Shifted segment layout for differential signal traces to mitigate bundle weave effect
An article of manufacture includes a circuit board and a pair of traces on or in the circuit board. The pair of traces includes a first trace and a second trace. The first trace includes a first segment and a second segment continuously joined to the first segment. The first segment coincides with a first longitudinal axis. The second trace includes a first segment that runs alongside the first segment of the first trace. The second trace also includes a second segment that runs alongside the second segment of the first trace. The second segment of the second trace is continuously joined to the first segment of the second trace. The second segment of the second trace coincides with the first longitudinal axis.
1. An article of manufacture comprising a circuit board and a pair of traces on or in the circuit board, the pair of traces including a first trace and a second trace, the first trace including a first segment and a second segment continuously joined to the first segment, the first segment coinciding with a first longitudinal axis, the second trace including a first segment that runs alongside the first segment of the first trace, the second trace also including a second segment that runs alongside the second segment of the first trace, the second segment of the second trace continuously joined to the first segment of the second trace, the second segment of the second trace coinciding with the first longitudinal axis,
wherein the first and second segments of the first trace and the first and second segments of the second trace are all substantially equal to each other in length; and
wherein the circuit board has glass fiber bundles embedded therein at a pitch that is twice a pitch distance between said first and second traces.
2. An article of manufacture comprising a circuit board and a pair of traces on or in the circuit board, the pair of traces including a first trace and a second trace, the first trace including a first segment and the second trace including a first segment that runs alongside the first segment of the first trace, the first segment of the first trace shifted from the first segment of the second trace by a trace pitch distance in a transverse direction perpendicular to a longitudinal direction of the first segment of the second trace, the first trace including a second segment that is continuously joined to the first segment of the first trace, the second segment shifted from the first segment of the first trace by the trace pitch distance in said transverse direction, the second trace including a second segment that runs alongside the second segment of the first trace, the second segment of the second trace continuously joined to the first segment of the second trace, the second segment of the second trace shifted from the first segment of the second trace by the trace pitch distance in said transverse direction;
wherein the first and second segments of the first trace and the first and second segments of the second trace are all substantially equal to each other in length; and
wherein the circuit board has glass fiber bundles embedded therein at a pitch that is twice a pitch distance between said first and second traces.
3. An article of manufacture comprising a circuit board and a pair of traces on or in the circuit board, the pair of traces including a first trace and a second trace, the first trace including a first segment and a second segment continuously joined to the first segment, the second trace including a first segment that runs alongside the first segment of the first trace, the second trace also including a second segment that runs alongside the second segment of the first trace, the second segment of the second trace continuously joined to the first segment of the second trace, the second segment of the second trace aligned with the first segment of the first trace;
wherein the first and second segments of the first trace and the first and second segments of the second trace are all substantially equal to each other in length; and
wherein the circuit board has glass fiber bundles embedded therein at a pitch that is twice a pitch distance between said first and second traces.