Pitch reduction

1. A method for providing features in an etch layer, comprising:

forming a sacrificial patterned layer with sacrificial features over an etch layer;

forming conformal sidewalls in the sacrificial features, comprising at least two cycles of a sidewall formation process, wherein each cycle comprises:

a sidewall deposition phase; and

a sidewall profile shaping phase, which shapes the sidewall profile to a vertical profile;

selectively removing parts of the sacrificial patterned layer between conformal sidewalls leaving the conformal sidewalls with gaps between the conformal sidewalls where parts of the sacrificial patterned layer were selectively removed; and

etching features in the etch layer using the conformal sidewalls as an etch mask, wherein the features in the etch layer are etched through the gaps between the conformal sidewalls where parts of the sacrificial patterned layer were selectively removed.

2. The method, as recited in claim 1 , wherein the sidewall deposition phase comprises:

providing a deposition gas;

forming a plasma from the deposition gas; and

stopping the flow of the deposition gas.

3. The method, as recited in claim 2 , wherein the sidewall profile shaping phase comprises:

providing a profile shaping gas different than the deposition gas;

forming a plasma from the profile shaping gas; and

stopping the flow of the profile shaping gas.

4. The method, as recited in claim 3 , wherein the forming the sacrificial patterned layer, comprises:

forming a sacrificial layer over the etch layer;

forming a patterned mask over the sacrificial layer; and

etching sacrificial features into the sacrificial layer.

5. The method, as recited in claim 4 , wherein the patterned mask is a photoresist mask, and wherein the forming the sacrificial patterned layer further comprises trimming the photoresist mask.

6. The method, as recited in claim 5 , wherein the forming the sacrificial patterned layer further comprises removing the photoresist mask after etching sacrificial features into the sacrificial layer.

7. The method, as recited in claim 6 , wherein the sacrificial patterned layer defines an array region and a logic region, further comprising covering the logic region of the sacrificial patterned layer after forming the sacrificial patterned layer, wherein the selectively removing parts of the sacrificial patterned layer removes uncovered parts of the sacrificial patterned layer.

8. The method, as recited in claim 7 , further comprising uncovering the logic region of the sacrificial patterned layer after selectively removing parts of the sacrificial patterned layer.

9. The method, as recited in claim 8 , further comprising removing the sidewalls and remaining parts of the sacrificial patterned layer.

10. The method, as recited in claim 9 , wherein the sidewalls are of deposited silicon.

11. The method, as recited in claim 10 , wherein the sidewalls have a substantially vertical slope.

12. The method, as recited in claim 1 , wherein the forming the patterned sacrificial layer comprises:

forming a photoresist layer over the etch layer;

patterning the photoresist layer to form a patterned photoresist mask, wherein the patterned photoresist mask is the patterned sacrificial layer and wherein the conformal sidewalls are formed on the photoresist mask.

13. The method, as recited in claim 3 , wherein the forming the sacrificial patterned layer, comprises:

forming a first sacrificial layer, second sacrificial layer, and etch stop stack, comprising:

forming the second sacrificial layer over the etch layer;

forming an etch stop layer over the second sacrificial layer; and

forming the first sacrificial layer over the etch stop layer;

forming a patterned mask over the first sacrificial layer;

etching sacrificial features into the first sacrificial layer;

forming conformal sidewalls in the sacrificial features of the first sacrificial layer;

selectively removing parts of the first sacrificial layer between the conformal sidewalls leaving the conformal sidewalls with gaps between the conformal sidewalls where parts of the first sacrificial layer where removed;

etching features into the second sacrificial layer to form the sacrificial patterned layer; and

removing the conformal sidewalls.

14. The method, as recited in claim 1 , wherein the forming the sacrificial patterned layer, comprises:

forming a photoresist mask over the sacrificial layer; and

trimming the photoresist mask, wherein the photoresist mask is the sacrificial, and wherein the conformal sidewalls are formed on the photoresist mask.

15. The method, as recited in claim 1 , wherein the sacrificial patterned layer defines an array region and a logic region, further comprising:

covering the logic region of the sacrificial patterned layer after forming the sacrificial patterned layer, wherein the selectively removing parts of the sacrificial patterned layer removes uncovered parts of the sacrificial patterned layer; and

uncovering the logic region of the sacrificial patterned layer after selectively removing parts of the sacrificial patterned layer.

16. The method, as recited in claim 1 , wherein the forming conformal sidewalls does not form a deposition along horizontal surfaces.

17. A method for providing features in an etch layer, comprising:

forming a sacrificial patterned layer with sacrificial features over an etch layer, wherein the sacrificial patterned layer defines an array region and a logic region, comprising,

providing a photoresist layer; and

forming a photoresist mask from the photoresist layer, wherein the sacrificially patterned layer is the photoresist mask;

covering the logic region of the sacrificial patterned layer, wherein parts of the sacrificial patterned layer defining the array region are uncovered;

forming conformal sidewalls in the sacrificial features wherein the sidewall are on the photoresist mask, comprising at least two cycles of a sidewall formation process, wherein each cycle comprises:

a sidewall deposition phase, comprising:

providing a deposition gas;

forming a plasma from the deposition gas; and

stopping the flow of the deposition gas; and

a sidewall profile shaping phase, which shapes the sidewall profile to a vertical profile, comprising:

providing a profile shaping gas different than the deposition gas;

forming a plasma from the profile shaping gas; and

stopping the flow of the profile shaping gas;

selectively removing uncovered parts of the sacrificial patterned layer between conformal sidewalls leaving the conformal sidewalls with gaps between the conformal sidewalls where parts of the sacrificial patterned layer were selectively removed;

uncovering the logic region of the sacrificial patterned layer; and

etching features in the etch layer using the conformal sidewalls as an etch mask, wherein the features in the etch layer are etched through the gaps between the conformal sidewalls where parts of the sacrificial patterned layer were selectively removed.

18. The method, as recited in claim 17 , wherein the forming the sacrificial patterned layer, further comprises trimming the photoresist mask.

19. The method, as recited in claim 11 , wherein the conformal sidewalls from bottom to top make an angle between 88° to 90° with the bottom of the sacrificial layer feature.

20. The method, as recited in claim 1 , wherein the conformal sidewalls are formed at a temperature less than 100° C.