Semiconductor device with a gate electrode having a laminate structure
A semiconductor device includes a semiconductor substrate having a semiconductor layer, a gate electrode, a source region, a drain region, an element separation insulating film layer and a wiring. The gate electrode include a laminated structure having a gate insulating film formed on the semiconductor layer, a metal or a metallic compound formed on the gate insulating film and a polycrystalline silicon layer formed on the metal or metallic compound. The source region and drain region are formed on a surface portion of the semiconductor substrate and sandwich the gate electrode therebetween. The element separation insulating film layer surrounds the semiconductor layer. The wiring is in contact with the metal or metallic compound of the gate electrode.
1. A semiconductor device comprising:
a semiconductor substrate including a semiconductor layer;
a gate electrode including:
a gate insulating film formed on the semiconductor layer,
a metal or a metallic compound formed on the gate insulating film,
a polycrystalline silicon layer formed on the metal or the metallic compound, and
a metal silicide formed on the polycrystalline silicon layer;
a source region and a drain region, which are formed on a surface portion of the semiconductor substrate, sandwiching the gate electrode therebetween;
an element separation insulating film layer surrounding the semiconductor layer; and
a plug that passes through the metal silicide and the polycrystalline silicon layer and contacts with the metal or the metallic compound of the gate electrode.
2. The semiconductor device according to claim 1 , wherein the gate electrode further includes a metal nitride film between the metal or the metallic compound and the polycrystalline silicon layer.
3. A fully depletion type transistor comprising:
a semiconductor device according to claim 1 ; and
an embedded insulating layer in the semiconductor substrate, wherein the metal or the metallic compound mainly includes one selected from the group consisting of Ta, NiSi, Ta 2 N, ZrC, WSi 2 , TiN, and TIC.
4. The semiconductor device according to claim 1 , wherein the plug is connected to the gate electrode over the element separation insulating film layer.
5. The semiconductor device according to claim 1 , wherein the gate electrode further includes a metal silicide on the polycrystalline silicon layer.
6. The semiconductor device according to claim 1 , wherein the plug includes:
a plug bottom portion formed of a metal silicide material, and
a plug upper portion formed on the plug bottom portion and formed of a metal material.
7. A complementary transistor comprising: an n-type MIS transistor including a semiconductor device according to claim 1 , in which the source region and the drain region are of n type; and a p-type MIS transistor including a semiconductor device according to claim 1 , in which the source region and the drain region are of p type.
8. The complementary transistor according to claim 7 , wherein a thickness of the metal or the metallic compound in each of the MIS transistors is equal to or less than 10 nm.
9. The complementary transistor according to claim 7 , wherein:
the metal or metallic compound in the n-type MIS transistor includes one selected from the group consisting of a rare earth metal silicide, a transition metal silicide, a germanide, a metal boride, and TaC, and
the metal or metallic compound in the p-type MIS transistor includes one selected from the group consisting of a metal carbide, a precious metal silicide, a metal nitride, a metal germanide, a W compound, and a precious metal.
10. The complementary transistor according to claim 9 , wherein:
the rare earth metal silicide, the transition metal silicide and the germanide include mainly one selected from the group consisting of ErSi 1.7 , YSi 2 , TaSi, and ErGe 1.7 ,
the metal boride includes mainly one selected from the group consisting of HfB, TaB, and TiB, the metal carbide includes mainly one selected from the group consisting of TiC and TaC, the precious metal silicide includes mainly one selected from the group consisting of PtSi and PdSi,
the metal nitride includes mainly one selected from the group consisting of TiN and TaN, the metal germanide includes mainly one selected from the group consisting of NiGe and PtGe,
the W compound includes mainly one selected from the group consisting of WC and WB, and
the precious metal includes mainly one selected from the group consisting of Pt, Au, Ir, Ru and W.
11. A semiconductor device comprising:
a semiconductor substrate including a semiconductor layer;
a gate electrode including:
a gate insulating film formed on the semiconductor layer,
a metal or a metallic compound formed on the gate insulating film,
a polycrystalline silicon layer formed on the metal or the metallic compound, and
a metal silicide formed on the polycrystalline silicon layer;
a source region and a drain region, which are formed on a surface portion of the semiconductor substrate, sandwiching the gate electrode therebetween;
an element separation insulating film layer surrounding the semiconductor layer; and
a plug that passes through the metal silicide, the polycrystalline silicon layer, the metal or the metallic compound and the gate insulating film and reaches the element separation insulating film layer.
12. The semiconductor device according to claim 11 , wherein the plug includes:
a plug bottom portion formed of a metal silicide material, and
a plug upper portion formed on the plug bottom portion and formed of a metal material.
13. The semiconductor device according to claim 11 , wherein the gate electrode further includes a metal nitride film between the metal or the metallic compound and the polycrystalline silicon layer.
14. A fully depletion type transistor comprising:
a semiconductor device according to claim 11 ; and
an embedded insulating layer in the semiconductor substrate,
wherein the metal or the metallic compound mainly includes one selected from the group consisting of Ta, NiSi, Ta 2 N, ZrC, WSi 2 , TiN, and TiC.
15. A complementary transistor comprising:
an n-type MIS transistor including a semiconductor device according to claim 11 , in which the source region and the drain region are of n type; and
a p-type MIS transistor including a semiconductor device according to claim 11 , in which the source region and the drain region are of p type.
16. The complementary transistor according to claim 15 , wherein:
the metal or the metallic compound in the n-type MIS transistor includes one selected from the group consisting of a rare earth metal silicide, a transition metal silicide, a germanide, a metal boride, and TaG, and
the metal or the metallic compound in the p-type MIS transistor includes one selected from the group consisting of a metal carbide, a precious metal silicide, a metal nitride, a metal germanide, a W compound, and a precious metal.
17. The complementary transistor according to claim 16 , wherein:
the rare earth metal suicide, the transition metal suicide and the germanide include mainly one selected from the group consisting of ErSi 1.7 , YSi 2 , TaSi, and ErGe 1.7 ,
the metal boride includes mainly one selected from the group consisting of HfB, TaB, and TiB,
the metal carbide includes mainly one selected from the group consisting of TiC and TaC,
the precious metal silicide includes mainly one selected from the group consisting of PtSi and PdSi,
the metal nitride includes mainly one selected from the group consisting of TiN and TaN,
the metal germanide includes mainly one selected from the group consisting of NiGe and PtGe,
the W compound includes mainly one selected from the group consisting of WC and WB, and
the precious metal includes mainly one selected from the group consisting of Pt, Au, Ir, Ru and W.
18. The complementary transistor according to claim 15 , wherein a thickness of the metal or the metallic compound in each of the MIS transistors is equal to or less than 10 nm.