Compact stabilized full-band power amplifier arrangement
View Patent ↗High frequency power amplification modules comprise a dielectric substrate supporting a stepped impedance transition coupled to the input of a power amplifier and a symmetrically disposed stepped impedance transition connected to the output of the power amplifier. The power amplification modules are oriented in an electromagnetic energy field so that input electromagnetic energy is coupled to the input of the power amplifier by the input side stepped impedance transition, amplified by the amplifier, and emitted from the module by the output side stepped impedance transition. A plurality of the power amplification modules may be organized into an array to provide a power combiner. The power amplification modules in the array may be linked by isolation impedances that decouple the modules in the array.
1. A high frequency power combining array, comprising:
an array of power amplifier modules to be located in an electromagnetic energy field;
each of said power amplifier modules comprising an input antenna on a dielectric substrate defining a stepped impedance transition to an input of a power amplifier and an output antenna on the dielectric substrate defining a stepped impedance transition from an output of the power amplifier; and
one or more resistive isolation impedances connecting selected power amplifier modules, the one or more resistive isolation impedances adapted to reduce instability and cross talk between the selected power amplifier modules by coupling energy to the selected power amplifier modules that is the inverse of at least a portion of the energy that can flow between the selected power amplifier modules so as to cancel out and/or dissipate energy that produces the instability and cross talk.
2. A high frequency power combining array, comprising:
an array of power amplifier modules adapted to be located in an electromagnetic energy field;
each of said power amplifier modules comprising a card adapted to perform as a dielectric substrate supporting a high frequency power amplifier, each card coated with one or more photolithographically patterned first conductive layers adapted to perform as an input antenna in the form of an impedance transition connected to an input of the power amplifier and each card also coated with one or more photolithographically patterned second conductive layers adapted to perform as an output antenna in the form of an impedance transition connected to an output of the power amplifier; and
one or more resistive isolation impedances connecting selected ones of said power amplifier modules, the one or more resistive isolation impedances adapted to reduce instability and cross talk between the selected power amplifier modules by coupling energy to the selected power amplifier modules that is the inverse of at least a portion of the energy that can flow between the selected power amplifier modules so as to cancel out and/or dissipate energy that produces the instability and cross talk.
3. The power combiner of claim 2 , in which one or more cards comprise a semiconductive substrate and the power amplifier is a high frequency amplifier integrated into the semiconductive substrate.
4. The power combiner of claim 3 , in which the high frequency amplifier is a monolithic integrated circuit.
5. The power combiner of claim 2 , in which the cards comprising the power amplifier modules are finline elements each having first and second sides, one or both of the first and second sides being coated with one or more photolithographically patterned conductive layers, the cards being arranged in a side by side orientation substantially parallel to one another;
the one or more resistive isolation impedances connecting one of the photolithographically patterned conductive layers on one of the sides of one of the cards to one of the photolithographically patterned conductive layers on one of the sides of another of the cards.
6. The power combiner of claim 5 , in which the one or more isolation impedances each comprise:
a thin rectangular dielectric substrate mounted between and substantially perpendicular to the cards of two of the power amplifier modules;
a resistor situated on the thin rectangular substrate; and
conductive material on the thin rectangular substrate connecting the resistor between conductive layers of the cards in two of the power amplifier modules.