Semiconductor device and method for fabricating the same
A seal ring structure is formed through a multilayer structure of a plurality of dielectric films in a peripheral part of a chip region to surround the chip region. A dual damascene interconnect in which an interconnect and a plug connected to the interconnect are integrated is formed in at least one of the dielectric films in the chip region. Part of the seal ring structure formed in the dielectric film in which the dual damascene interconnect is formed is continuous. A protection film formed on the multilayer structure has an opening on the seal ring. A cap layer connected to the seal ring is formed in the opening.
1. A semiconductor device comprising:
an element formed on a substrate in a chip region;
a multilayer structure including a plurality of dielectric films formed on the substrate;
an interconnect formed in at least one of the dielectric films in the chip region;
a plug formed in at least one of the dielectric films in the chip region and connecting either the element and the interconnect or the interconnect and another interconnect;
a seal ring structure formed through the multilayer structure in a peripheral part of the chip region and surrounding the chip region; and
a protection film formed on the multilayer structure in which the interconnect, the plug and the seal ring are provided,
wherein a dual damascene interconnect in which the interconnect and the plug connected to the interconnect are integrated is formed in at least one of the dielectric films in the chip region,
a part of the seal ring structure located in the dielectric film in which the dual damascene interconnect is formed is continuous,
the seal ring structure includes at least two seal rings surrounding the chip region,
the protection film has a first opening only on a top of an outermost seal ring out of the seal rings, and
a cap layer is formed in the first opening to be connected to the outermost seal ring.
2. The device of claim 1 , wherein at least part of the seal ring structure is buried in a recess portion formed in one of the dielectric films or in at least two successive dielectric films out of the plurality of dielectric films, and
the recess portion has an aspect ratio of three or more.
3. The device of claim 1 , wherein each of the seal rings is divided into at least two branches in at least one of the dielectric films.
4. The device of claim 1 , wherein the seal ring structure includes at least one material selected from the group consisting of W, Al and Cu.
5. The device of claim 1 , wherein the cap layer includes Al.
6. The device of claim 1 , wherein the protection film has a second opening on the interconnect and a pad electrode connected to the interconnect is formed in the second opening.