IP Library › Granted Patent US 7,456,052
Granted Patent B2
US 7,456,052 · App. 10/748,565 · Granted Nov 25, 2008

Thermal intermediate apparatus, systems, and methods

Assignee: Intel Corporation
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Quick Facts
Patent No.
US 7,456,052
App. No.
10/748,565
Granted
Nov 25, 2008
Kind
B2
Abstract

Apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure comprised of a plurality of carbon nanotubes some of which have organic moieties attached thereto to tether the nanotubes to at least one of a die and a heat sink. The organic moieties include thiol linkers and amide linkers.

Claims (8)

1. A process:

coating at least one surface of least one of a heat sink and of a die with a metal;

oxidizing carbon nanotubes ropes in sulfuric and nitric acids, whereby the carbon nanotubes ropes are cut into a plurality of short carbon nanotubes with open ends having carboxyl linkages attached thereto;

treating at least one end of at least some of a plurality of carbon nanotubes by applying organic moieties thereto; and

tethering one end of the at least some of the carbon nanotubes of the plurality of carbon nanotubes to the metal.

2. The process of claim 1 wherein the metal is selected from the group consisting of gold and gold alloys.

3. The process of claim 2 , wherein the treating the at least one end of some of the plurality of nanotubes comprises forming an amide based linkage thereon.

4. The process of claim 2 , wherein the treating the at least one end of some of the plurality of nanotubes comprises forming an amide based linkage and a thiol based linkage thereon.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2004
From: GARNER, C. MICHAEL
To: INTEL CORPORATION
Reel/Frame 014801/0572 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2003
From: WHITE, BRYAN M.; KONING, PAUL A.; ZHANG, YUEGANG
To: INTEL CORPORATION
Reel/Frame 014860/0550 →
Continuity (1)
Related Publication 20050139991A1 · Jun 30, 2005