IP Library › Granted Patent US 7,456,500
Granted Patent B2
US 7,456,500 · App. 10/529,718 · Granted Nov 25, 2008

Light source module and method for production thereof

Assignee: Osram Opto Semiconductors GmbH
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Quick Facts
Patent No.
US 7,456,500
App. No.
10/529,718
Granted
Nov 25, 2008
Kind
B2
Abstract

A light source module having a plurality of LEDs connected to a metal carrier ( 4 ) by means of an insulating layer ( 3 ). In order to afford protection against mechanical effects and in order to form a reflector, the LEDs are surrounded by a frame ( 10 ), which is segmented into a plurality of parts by expansion joints ( 13 ), in order that stresses occurring as a result of temperature fluctuations are absorbed.

Claims (18)

1. A light source module, comprising:

a metal carrier,

a plurality of LEDs connected to the metal carrier in an insulating manner,

a frame surrounding the plurality of LEDs, the frame comprising expansion joints, the expansion joints each comprising a separation cut,

potting composition arranged between the frame and the plurality of LEDs, and

a printed circuit board disposed between the frame and the metal carrier for electrically connecting the plurality of LEDs, the printed circuit board being arranged to cover portions of the metal carrier;

wherein the plurality of LEDs are connected to the metal carrier on regions of the metal carrier that are not covered by the printed circuit board.

2. The light source module as claimed in claim 1 , wherein the frame is segmented into a plurality of frame parts by the expansion joints.

3. The light source module as claimed in claim 2 , wherein a maximum of four cutouts for receiving LEDs are provided per each of the frame parts.

4. A method for producing a light source module as claimed in claim 2 , wherein the segmentation of the frame is carried out by means of a sawing device, so that separating cuts arise between the frame parts.

5. The light source module as claimed in claim 1 , wherein the frame is produced from plastic.

6. The light source module as claimed in claim 1 , wherein the frame is adhesively bonded at the underside toward the printed circuit board.

7. The light source module as claimed in claim 1 , wherein the metal carrier is produced from aluminum or copper.

8. The light source module as claimed in claim 1 , wherein the LEDs are arranged in a grid.

9. The light source module as claimed in claim 1 , wherein the printed circuit board is a flexible printed circuit board.

10. The light source module as claimed in claim 1 , wherein two LEDs are separated from each other by said frame, and the two LEDs are electrically interconnected by said printed circuit board.

11. The light source module as claimed in claim 10 , wherein each LED comprises several optoelectronic components arranged on a carrier substrate.

12. The light source module as claimed in claim 11 , wherein said printed circuit board is arranged between said carrier substrates.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 27, 2005
From: KROMOTIS, PATRICK; WAITL, GUNTER
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 017139/0918 →
Priority Claims (1)
DE 102 45 945 · Sep 30, 2002 · national
Continuity (1)
Related Publication 20060138441A1 · Jun 29, 2006