Resistor structure for ESD protection circuits
A semiconductor device includes an ESD protection device on a substrate, and a resistor having a gate structure overlying a resistor well separating a first doped region coupled to the ESD protection device and a second doped region coupled to a supply voltage for passing an ESD current from the second doped region to the first doped region to turn on the ESD protection device for dissipating the ESD current during an ESD event. The resistor well has an impurity density lower than that of the first and second doped regions for increasing resistance therebetween.
1. A semiconductor device comprising:
a first well formed on a substrate;
an electrostatic discharge (ESD) protection device formed on the first well;
a resistor well adjacent to the first well, the resistor well having a different polarity type as opposed to that of the first well;
a resistor having a gate structure formed on the resistor well separating a first doped region coupled to the ESD protection device and a second doped region coupled to a supply voltage for passing an ESD current from the second doped region to the first doped region to turn on the ESD protection device for dissipating the ESD current during an ESD event; and
a buried well formed beneath the second doped region and adjacent to the resistor well, wherein the resistor well has an impurity density lower than that of the first and second doped regions for increasing resistance therebetween,
wherein the ESD protection device is a MOS transistor having a gate and a source connected together to ground.
2. The semiconductor device of claim 1 wherein the gate structure comprises a stack of gate dielectric and gate conductive layers surrounded by spacers on their sides.
3. The semiconductor device of claim 1 wherein the resistor well, the first doped region and the second doped region are doped with P-type impurities.
4. The semiconductor device of claim 1 further comprising a first silicide layer on the first doped region and a second silicide layer on the second doped region, wherein the first and second silicide layers are separated by the gate structure.
5. The semiconductor device of claim 1 wherein the resistor well, the first doped region and the second doped region are doped with N-type impurities.
6. A semiconductor device comprising:
a first well formed on a substrate;
an ESD protection device formed on the first well; and
a resistor well adjacent to the first well, the resistor well having a different polarity type as opposed to that of the first well;
a resistor having a gate structure formed on the resistor well separating a first doped region coupled to the ESD protection device and a second doped region coupled to a supply voltage for passing an ESD current from the second doped region to the first doped region to turn on the ESD protection device for dissipating the ESD current during an ESD event;
a buried well formed beneath the second doped region and adjacent to the resistor well;
a first suicide layer on the first doped region; and
a second silicide layer on the second doped region, the first and second silicide layers being separated by the gate structure,
wherein the resistor well has an impurity density lower than that of the first and second doped regions for increasing resistance therebetween,
wherein the ESD protection device is a MOS transistor having a gate and a source connected together to ground.
7. The semiconductor device of claim 6 wherein the gate structure comprises a stack of gate dielectric and gate conductive layers surrounded by spacers on their sides.
8. The semiconductor device of claim 6 wherein the resistor well, the first doped region and the second doped region are doped with P-type impurities.