Voltage controlled surface acoustic wave oscillator module
A module for a surface acoustic wave oscillator includes a substrate having a top surface, a bottom surface and peripheral side faces. Several castellations are located about the outer peripheral side faces thereof. The castellations form an electrical connection between the top and bottom surfaces of the substrate. Connection pads are mounted on the top surface and are adapted for connection to the castellations. An oscillator circuit and a surface acoustic wave device are mounted on the top surface and connected to the connection pads. A cover is mounted over the substrate and has at least one tab adapted to be fitted within a respective one of the castellations. The overall module with the cover has a dimension of approximately 5 mm in width, 7 mm in length, and 2.7 mm in height.
1. A surface acoustic wave oscillator module, comprising:
a single substrate having a top surface, a bottom surface and an outer peripheral edge;
a plurality of castellations located about the outer peripheral edge, the castellations forming an electrical connection between the top surface and the bottom surface;
at least one metallized slot located about the outer peripheral edge;
at least one connection pad mounted on the top surface of said single substrate and connected to at least one of the castellations;
an oscillator circuit mounted on the top surface of said single substrate and connected to at least one of the connection pads;
a surface acoustic wave device hermetically sealed in a package, the package being mounted to the top surface of said single substrate and connected to at least one of the connection pads and coupled to the oscillator circuit; and
a cover having at least one tab, the cover mounted to the top surface of the substrate, the tab being adapted to be fitted within the metallized slot, the tab and the metallized slot forming an electrical connection between the cover and the metallized slot.
2. The oscillator module according to claim 1 , wherein the substrate has an inductor formed by a circuit line.
3. The oscillator module according to claim 2 , wherein the substrate has at least one inner layer located between the top and bottom surfaces, the circuit line being formed on the inner layer.
4. The oscillator module according to claim 2 , wherein the circuit line is located under the surface acoustic wave device.
5. The oscillator module according to claim 1 , wherein the substrate is a printed circuit board.
6. The oscillator module according to claim 1 , wherein the module has dimensions of approximately 5 mm in width, 7 mm in length and 2.7 mm in height.
7. A voltage controlled surface acoustic wave oscillator module, comprising:
a single printed circuit board having a top surface, a bottom surface and an outer peripheral edge;
a plurality of conductive castellations located about the outer peripheral edge, the castellations forming an electrical connection between the top surface and the bottom surface;
at least one metallized slot located about the outer peripheral edge;
a plurality of connection pads mounted on the top surface, at least one of the connection pads being connected to at least one of the castellations;
an oscillator circuit mounted to the top surface of the single printed circuit board to a first portion of the connection pads;
a pre-packaged hermetically sealed surface acoustic wave device mounted to the top surface of the single printed circuit board to a second portion of the connector pads;
a cover having at least one tab, the cover being mounted to the top surface of the printed circuit board and enclosing the oscillator circuit and the surface acoustic wave device; and
the tab being engaged with the metallized slot.
8. The oscillator module according to claim 7 , wherein the printed circuit board has at least one inner layer located between the top and bottom surfaces.
9. The oscillator module according to claim 8 , wherein a circuit line is located on the inner layer, the circuit line defining, an inductor.
10. The oscillator module according to claim 7 , wherein the cover has at least one shoulder adapted to rest on the top surface and defines a gap between the printed circuit board and the cover.
11. The oscillator module according to claim 9 , wherein the circuit line is located under the surface acoustic wave device.
12. The oscillator module according to claim 7 , wherein the cover is spaced from the top surface by a gap.
13. The oscillator module according to claim 7 , wherein the oscillator has dimensions of approximately 5 mm in width, 7 mm in length and 2.7 mm in height.
14. A surface acoustic wave oscillator module comprising:
a single printed circuit board substrate having a plurality of electrical components mounted to the top surface thereof including a surface acoustic wave resonator in a hermetically sealed package; and
a cover seated over the single printed circuit board substrate and the plurality of components so as to define an oscillator module having overall dimensions of approximately 5 mm in width, 7 mm in length and 2.7 mm in height.
15. The oscillator module of claim 14 , wherein the cover includes side walls defining lower peripheral edges with shoulders formed thereon such that a gap is defined between the printed circuit substrate and the cover when the cover is seated over the printed circuit board substrate.