IP Library › Granted Patent US 7,470,926
Granted Patent B2
US 7,470,926 · App. 11/220,777 · Granted Dec 30, 2008

Solid-state optical device

Assignees: Toyoda Gosei Co., Ltd; Sumita Optical Glass, Inc.
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Quick Facts
Patent No.
US 7,470,926
App. No.
11/220,777
Granted
Dec 30, 2008
Kind
B2
Abstract

A solid-state optical device having: a solid-state element; a power supplying/retrieving portion that supplies or retrieves electric power to/from the solid-state element; and a glass sealing material that seals the solid-state element. The glass sealing material is made of a P 2 O 5 —ZnO-based low-melting glass that has 45 to 50 wt % of P 2 O 5 and 15 to 35 wt % of ZnO.

Claims (22)

1. A solid-state optical device, comprising:

a solid-state element;

a power supplying/retrieving portion on which the solid-state element is mounted, the power supplying/retrieving portion supplying or retrieving electric power to/from the solid-state element; and

a glass sealing material that seals the solid-state element,

wherein the glass sealing material has a thermal expansion coefficient equivalent to that of the power supplying/retrieving portion, and

wherein the glass sealing material comprises a B 2 O 3 —SiO 2 —Na 2 O—ZnO—Nb 2 O 5 -based low-melting glass that comprises 19 to 30 wt % of B 2 O 3 , 0.5 to 15 wt % of SiO 2 , 1.5 to 8 wt % of Na 2 O, 44 to 60 wt % of ZnO, and 9 to 19 wt % of Nb 2 O 5 in weight %.

2. The solid-state optical device according to claim 1 , wherein:

the low-melting glass further comprises 0 to 5 wt % of Al 2 O 3 , 0 to 3 wt % of Li 2 O, 0 to 4 wt % of K 2 O, 0 to 5 wt % of MgO, 0 to 5 wt % of CaO, 0 to 5 wt % of SrO, 0 to 5 wt % of BaO, 0 to 4 wt % of ZrO 2 , and 0 to 4 wt % of TiO 2 in weight %.

3. The solid-state optical device according to claim 1 , wherein:

the low-melting glass has a thermal expansion coefficient equivalent to that of the solid-state element.

4. The solid-state optical device according to claim 1 , wherein:

the solid-state element is flip-chip mounted.

5. The solid-state optical device according to claim 1 , wherein:

the power supplying/retrieving portion comprises an inorganic material substrate that comprises a conductive pattern to supply or retrieve electric power to/from the solid-state element, and

the glass sealing material has a thermal expansion coefficient equivalent to that of the inorganic material substrate.

6. The solid-state optical device according to claim 1 , wherein:

the glass sealing material comprises a coating, which effects a moisture resistance and acid/alkali resistance, formed on a surface thereof.

7. The solid-state optical device according to claim 1 , wherein:

the solid-state element comprises an optical element, and

the glass sealing material comprises a light-transmitting material.

8. The solid-state optical device according to claim 1 , wherein:

the glass sealing material is over molded with a resin.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 25, 2005
From: SUEHIRO, YOSHINOBU; YAMAGUCHI, SEIJI; SAWANOBORI, NARUHITO; OHTSUKA, MASAAKI; WATANABE, HIROKI; AIDA, KAZUYA
To: TOYODA GOSEI CO., LTD.; SUMITA OPTICAL GLASS, INC.
Reel/Frame 016936/0801 →
Priority Claims (3)
JP 2004-262908 · Sep 9, 2004 · national
JP 2004-263098 · Sep 9, 2004 · national
JP 2005-140284 · May 12, 2005 · national
Continuity (1)
Related Publication 20060049421A1 · Mar 9, 2006