Encapsulation for particle entrapment
A packaged micromechanical device ( 100 ) having a blocking material ( 116 ) encapsulating debris-generating regions thereof. The blocking material ( 116 ) prevents the generation of debris that could interfere with the operation of the micromechanical device ( 100 ). Debris-generating regions of the device ( 100 ), including debris-creating sidewalls and any debris-harboring cavities, as well as electrical connections ( 108 ) linking the device ( 100 ) to the package substrate ( 102 ) are encapsulated by the blocking material ( 116 ). The blocking material ( 116 ) avoids contact with any debris-intolerant regions ( 118 ) of the device ( 100 ). A package lid ( 122 ), which is glass in the case of many DMD packages, seals the device ( 100 ) in package cavity ( 120 ).
1. A method of protecting debris-intolerant micromechanical devices, said method comprising:
providing a device having at least one debris-generating region, and at least one debris-intolerant region;
encapsulating at least one of said debris-generating regions and at least a portion of at least one of said debris-intolerant regions with a blocking material;
removing said blocking material from said at least one of said debris-intolerant regions; and
attaching a package lid to said package substrate, to enclose said device and said blocking material.
2. The method of claim 1 , said attaching a device step further comprising:
attaching a device to a substrate, said device having at least one said debris-generating region comprising a sidewall.
3. The method of claim 1 , said encapsulating step further comprising:
encapsulating at least one of said debris-generating regions using an adhesive blocking material.
4. The method of claim 1 , said encapsulating step further comprising:
encapsulating at least one of said debris-generating regions using a photo-curable adhesive blocking material.
5. The method of claim 1 , said encapsulating step further comprising:
encapsulating at least one of said debris-generating regions using an adhesive blocking material that remains tacky to perform a gettering function.
6. The method of claim 1 , further comprising the step of:
electrically connecting at least one bond pad on said substrate with at least one bond pad on said device using an electrical connection.
7. The method of claim 6 , said encapsulating step comprising:
encapsulating at least one of said debris-generating regions and said electrical connection.
8. The method of claim 6 , said encapsulating step comprising:
electrically connecting at least one bond pad on said substrate with at least one bond pad on said device using a bond wire.
9. The method of claim 6 , said encapsulating step comprising:
encapsulating at least one of said debris-generating regions and said bond wires.