Method for processing by laser, apparatus for processing by laser, and three-dimensional structure
View Patent ↗A laser processing method where laser beam for processing is irradiated on a processing object and the laser beam for processing directly removes a part of the processing object. The processing object is made of a glass substrate, metal thin film having high absorption to laser beam for processing is formed on a surface of glass substrate, into which laser beam for processing is made incident, the laser beam for processing is irradiated from a surface of metal thin film, and matter is directly removed by irradiation of laser beam onto the processing object in order to form a region finer than an irradiation region of laser beam for processing on the processing object.
1. A three-dimensional structure, comprising:
a substrate which is to be processed by a laser beam; and
a metal thin film which is formed on a surface of the substrate, the laser beam being made incident onto the surface;
wherein
the metal thin film includes a film-removing region;
the substrate includes a substrate-removing region;
the metal thin film has high absorption to the laser beam;
the film-removing region and the substrate-removing region are formed by irradiating the laser beam onto the metal thin film;
the substrate-removing region is finer than the film-removing region; and
a region to be processed of the film-removing region and the substrate-removing region has a width of a few hundred nanometers to a few tens of micrometers and a depth of a few nanometers to a few micrometers.
2. The three-dimensional structure as claimed in claim 1 , wherein the film-removing region is configured to be removed.
3. The three-dimensional structure as claimed in claim 2 , wherein a metal film is formed after the metal thin film has been removed.
4. The three-dimensional structure as claimed in claim 1 , wherein a film thickness of the metal thin film is at least a light permeability length of the laser beam.
5. The three-dimensional structure as claimed in claim 1 , wherein a width of a region irradiated by the laser beam is substantially equal to a width of the film-removing region.
6. The three-dimensional structure as claimed in claim 1 , wherein a width of the substrate-removing region is smaller than a width of a region irradiated by the laser beam.
7. The three-dimensional structure as claimed in claim 1 , wherein the substrate-removing region has a width of 2 μm and a depth of 20 nm.
8. A three-dimensional structure, comprising:
a substrate which is to be processed by a laser beam; and
a platinum layer which is formed on a surface of the substrate, the laser beam being made incident onto the surface;
wherein
the platinum layer includes a layer-removing region;
the substrate includes a substrate-removing region;
the platinum layer has high absorption to the laser beam;
the layer-removing region and the substrate-removing region are formed by irradiating the laser beam onto the platinum layer;
the substrate-removing region of the substrate has a first region and a second region;
the first region is positioned between the layer-removing region of the platinum layer and the second region;
the first region has a same width as the layer-removing region of the platinum layer; and
the second region has a finer width than the first region.
9. The three-dimensional structure as claimed in claim 8 , wherein the layer-removing region is configured to be removed.