Method for manufacturing semiconductor device

1. A method for manufacturing a semiconductor device, the method comprising the steps of:

forming a plurality of concave portions on a front surface of a first substrate;

forming a wiring extending from the inside of the plural concave portions to a rear surface of the first substrate;

mounting a semiconductor element on each of the plural concave portions;

encapsulating the semiconductor element by bonding the front surface of the first substrate to a second substrate made of a material different from a material of the first substrate;

forming a first groove in the first substrate and a second groove in the second substrate; and

individualizing the semiconductor device by cleaving a portion between the first groove and the second groove so as to individualize the semiconductor device;

wherein the individualized semiconductor device includes at least one of the concave portions on which the semiconductor element is mounted.

2. The method for manufacturing a semiconductor device according to claim 1 , wherein

the semiconductor element is made of an optical functional element.

3. The method for manufacturing a semiconductor device according to claim 2 , wherein

the second substrate is made of an optically transparent material.

4. The method for manufacturing a semiconductor device according to claim 1 , wherein

the first substrate and the second substrate are bonded by anodic bonding.

5. The method for manufacturing a semiconductor device according to claim 1 ,

wherein the wiring penetrates the first substrate;

wherein the semiconductor element is connected to the wiring.

6. The method for manufacturing a semiconductor device according to claim 1 , wherein

a periphery of the concave portion of the front surface is bonded to the second substrate.