Group III nitride semiconductor light-emitting device and method of producing the same
A Group III nitride semiconductor light-emitting device includes a stacked structure 11 formed on a crystal substrate ( 100 ) to be removed from it and including two Group III nitride semiconductor layers 104 and 106 having different electric conductive types and a light-emitting layer 105 which is stacked between the two Group III nitride semiconductor layers and which includes a Group III nitride semiconductor, and a plate body 111 made of material different from that of the crystal substrate and formed on a surface of an uppermost layer which is opposite from the crystal substrate that is removed from the stacked structure.
1. A Group III nitride semiconductor light-emitting device comprising:
a stacked structure formed on a crystal substrate, removable from the stacked structure, and including two Group III nitride semiconductor layers having different electric conductive types and a light-emitting layer which is stacked between the two Group III nitride semiconductor layers and which comprises a Group III nitride semiconductor; and
a plate body made of material different from that of the crystal substrate and formed on a surface of an uppermost layer which is opposite from the crystal substrate that is removable from the stacked structure,
wherein the crystal substrate is a sapphire substrate having a (0001) face on which the stacked structure is formed, the plate body is a conductive (001)-Si monocrystal, and
wherein the plate body has a <110> crystal orientation that is in parallel to a [1.1.-2.0] crystal orientation of the (0001)-sapphire substrate.
2. The Group III nitride semiconductor light-emitting device according to claim 1 , wherein the plate body is made of conductive material.
3. The Group III nitride semiconductor light-emitting device according to claim 1 , wherein the crystal substrate is removed from the stacked structure by irradiating laser beams onto a junction interface region between the stacked structure and the crystal substrate.
4. The Group III nitride semiconductor light-emitting device according to claim 1 , further comprising an ohmic electrode provided on the plate body.
5. The Group III nitride semiconductor light-emitting device according to claim 1 , wherein the plate body is formed on the surface of the uppermost layer through a metal layer.
6. The Group III nitride semiconductor light-emitting device according to claim 5 , wherein the metal layer comprises eutectic metal film.
7. The Group III nitride semiconductor light-emitting device according to claim 1 , further comprising a metal reflection film for reflecting light from the light-emitting layer provided between the plate body and the surface of the uppermost layer.
8. A method of producing a Group III nitride semiconductor light-emitting device comprising:
a stacked structure formed on a crystal substrate removable from the stacked structure, and including two Group III nitride semiconductor layers having different electric conductive types and a light-emitting layer which is stacked between the two Group III nitride semiconductor layers and which comprises a Group III nitride semiconductor; and
a plate body made of material different from that of the crystal substrate and formed on a surface of an uppermost layer which is opposite from the crystal substrate that is removable from the stacked structure,
wherein the crystal substrate is a sapphire substrate having a (0001) face on which the stacked structure is formed, the plate body is a conductive (001)-Si monocrystal, and
wherein the plate body has a <110> crystal orientation that is in parallel to a [1.1.-2.0] crystal orientation of the (0001)-sapphire substrate,
said method comprising the steps of:
forming on a crystal substrate to be removed a stacked structure including two Group III nitride semiconductor layers having different electric conductive types and a light-emitting layer which is stacked between the two Group III nitride semiconductor layers and which comprises a Group III nitride semiconductor;
forming a plate body made of material different from that of the crystal substrate on a surface of an uppermost layer which is opposite from the crystal substrate; and
removing the crystal substrate.