IP Library › Granted Patent US 7,495,912
Granted Patent B2
US 7,495,912 · App. 11/309,919 · Granted Feb 24, 2009

Heat dissipation device

Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd.
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Quick Facts
Patent No.
US 7,495,912
App. No.
11/309,919
Granted
Feb 24, 2009
Kind
B2
Abstract

A heat dissipation device includes a heat sink ( 10 ) in thermal contact with a first heat-generating electronic component. A fan duct ( 30 ) receives the heat sink therein and has an inlet ( 350 ) and an outlet ( 302 ) at opposite sides thereof. A fan ( 20 ) is mounted in the fan duct at the inlet. A portion of airflow generated by the fan flows through the heat sink to cool the first heat-generating electronic component. A shutter ( 31 ) is mounted on the fan duct. Another portion of the airflow generated by the fan flows through the shutter to blow a second heat-generating electronic component located beside the first heat-generating electronic component and outside the fan duct.

Claims (25)

1. A heat dissipating device comprising:

a heat sink comprising a base for contacting with a first heat-generating electronic device and a plurality of fins on the base, said fins forming a plurality of channels therebetween, the channels extending along a front-to-rear direction;

a fan mounted to a front side of the fins;

a fan duct covering the heat sink and the fan therein; and

a shutter detachably coupled to the fan duct, wherein an airflow generated by the fan has a portion flowing through the channels of the fins to cool the first heat-generating electronic component and another portion flowing through the shutter for blowing onto a second heat generating electronic device beside the first heat generating electronic device.

2. The heat dissipation device as described in claim 1 , wherein the fan duct defines a window therein.

3. The heat dissipation device as described in claim 2 , wherein the shutter is coupled to the fan duct at the window.

4. The heat dissipation device as described in claim 3 , wherein the shutter comprises a frame, the frame having a pair of spaced mounting plates and a plurality of vanes sandwiched between the mounting plates.

5. The heat dissipation device as described in claim 4 , wherein the vanes extend into an inner space of the fan duct from the window, and two opposite outmost vanes of the vanes are engaged with inner sides of the fan duct adjacent to the window of the fan duct.

6. The heat dissipation device as described in claim 5 , wherein the fins have a stepped configuration.

7. The heat dissipation device as described in claim 5 , wherein a notch is defined in the fan duct beside the window and communicates with the window.

8. The heat dissipation device as described in claim 7 , wherein one of the two outmost vanes forms a block at an outer side thereof engaged with a corresponding inner side of the fan duct and the other of the two outmost vanes forms a hook at an outer edge thereof engaged in the notch of the fan duct.

9. The heat dissipation device as described in claim 6 , wherein the vanes have different lengths which gradually increase along the front-to-rear direction.

10. The heat dissipation device as described in claim 6 , wherein the vanes are oblique to the mounting plates.

11. The heat dissipation device as described in claim 5 , wherein the fan duct comprises a top plate, first and second baffle plates extending downwardly and perpendicularly from two opposite lateral sides of the top plate, and the window is defined in the second baffle plate.

12. The heat dissipation device as described in claim 11 , wherein a faceplate is formed at a front end of the top plate and connects with the lateral baffle plates, an opening being defined in the faceplate.

13. The heat dissipation device as described in claim 12 , wherein the fan received in the fan duct is aligned with the opening of the faceplate and abuts against the faceplate.

14. A heat dissipation device comprising:

a heat sink in thermal contact with a first heat-generating electronic component;

a fan duct receiving the heat sink therein and having an inlet and an outlet at opposite sides thereof;

a fan mounted in the fan duct at the inlet, wherein a portion of airflow generated by the fan flows through the heat sink to cool the first heat-generating electronic component; and

a shutter mounted on the fan duct, wherein another portion of the airflow generated by the fan flows through the shutter to blow a second heat-generating electronic component;

wherein the fan duct defines a window therein for engaging with the shutter; and

wherein the shutter comprises an outer frame having a pair of spaced mounting plates and a plurality of vanes sandwiched between the pair of spaced mounting plates, the frame located beyond the window and the plurality of vanes extending into an inner space of the fan duct.

15. The heat dissipation device as claimed in claim 14 , wherein the shutter is detachably mounted on the fan duct.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 6, 2009
From: FOXCONN TECHNOLOGY CO., LTD.
To: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.; FOXCONN TECHNOLOGY CO., LTD.
Reel/Frame 022058/0451 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 27, 2006
From: LONG, JUN; LI, HAO; LI, TAO
To: FOXCONN TECHNOLOGY CO., LTD.
Reel/Frame 018448/0498 →
Continuity (1)
Related Publication 20080101018A1 · May 1, 2008