Method of manufacturing liquid discharge head and method of manufacturing substrate for liquid discharge head
A method of manufacturing a liquid discharge head, which includes a pressure generating chamber, a discharge port, and a piezoelectric element formed of a pair of electrode films sandwiching a piezoelectric material film, includes steps of preparing a structure with a single crystal Si layer accumulated above a front surface of an Si substrate through an etching stop layer; forming a buffer layer on the single crystal Si layer; forming, above the buffer layer, the piezoelectric material film which is directed in a preferential orientation to a direction of the polarization through one of the pair of electrode films; forming the pressure generating chamber on the piezoelectric material film; and etching a location corresponding to the piezoelectric material film of the Si substrate from a rear surface of the Si substrate to reach the etching stop layer.
1. A method of manufacturing a liquid discharge head comprising a pressure generating chamber communicating with a discharge port for discharging liquid, and a piezoelectric element which is provided corresponding to the pressure generating chamber and includes a piezoelectric material film and a pair of electrode films sandwiching the piezoelectric material film, comprising:
a step of preparing a structure with a single crystal Si layer accumulated above a front surface of an Si substrate with an etching stop layer intervening between the single crystal Si layer and the front surface of the Si substrate;;
a step of forming a buffer layer on the single crystal Si layer;
a step of forming, above the buffer layer, the piezoelectric material film comprising a single crystal thin film or a thin film which is directed in a preferential orientation to a direction of the polarization with one of the pair of electrode films intervening between the buffer layer and the piezoelectric material film;;
a step of forming the pressure generating chamber on the piezoelectric material film; and
a step of etching a location corresponding to the piezoelectric material film of the Si substrate from a rear surface of the Si substrate to reach the etching stop layer.
2. The method of manufacturing a liquid discharge head according to claim 1 , wherein a sacrifice layer capable of selectively implementing etching is provided between the front plane of the Si substrate and the etching stop layer.
3. The method of manufacturing a liquid discharge head according to claim 1 , further comprising a step of removing a part of the substrate and a part of the etching stop layer and thereby forming, onto the substrate, a liquid supply orifice communicating with the pressure generating chamber.
4. The method of manufacturing a liquid discharge head according to claim 1 , wherein the plane orientation of the front surface of the Si substrate is {110}.
5. The method of manufacturing a liquid discharge head according to claim 1 , wherein the etching comprises crystal axis anisotropy etching.
6. The method of manufacturing a liquid discharge head according to claim 1 , wherein the step of forming the pressure generating chamber comprises: a step of forming a pattern to become the pressure generating chamber onto a vibration plate; a step of forming a member to configure walls of the pressure generating chamber onto the pattern; and a step of removing the pattern and forming the pressure generating chamber.
7. The method of manufacturing a liquid discharge head according to claim 6 , wherein the step of removing the pattern and forming the pressure generating chamber is implemented after the step of implementing the etching.
8. A method of manufacturing a substrate for a liquid discharge head comprising a piezoelectric element which includes a piezoelectric material film and a pair of electrode films sandwiching the piezoelectric material film, comprising:
a step of preparing a structure with a single crystal Si layer accumulated above a front surface of an Si substrate with an etching stop layer intervening between the single crystal Si layer and the front surface of the Si substrate;
a step of forming a buffer layer on the single crystal Si layer;
a step of forming, above the buffer layer, the piezoelectric material film comprising a single crystal thin film or a thin film which is directed in a preferential orientation to a direction of polarization with one of the electrode films intervening between the buffer layer and the piezoelectric material film; and
a step of etching a location corresponding to the piezoelectric material film of the Si substrate from a rear surface of the Si substrate to reach the etching stop layer.