Heat transfer mechanism, heat dissipation system, and communication apparatus

1. A heat transfer mechanism for dissipating heat from a heat generating body to a heat dissipating part, the heat generating body being directly coupled, at its bottom surface, to a common board, comprising:

a film-shaped heat conductor for transferring heat from a top surface of the heat generating body to the heat dissipating part; and

an elastic member directly coupled, on one hand, with said heat dissipating part and, on the other hand, with said film-shaped heat conductor, the length of which is shorter than the length of the top surface of said heat generating body, for imparting elasticity to the film-shaped heat conductor,

said film-shaped heat conductor being formed from a metal foil-type flexible heat pipe,

wherein said film-shaped heat conductor has a double bent shape of two parallel legs connected by a middle portion that offsets the two parallel legs with obtuse angles and transfers heat from the top surface of the heat generating body to the heat dissipating part along the double bent heat conductor by sandwiching the lower portion of said double bent heat conductor between said heat generating body and said elastic member so that said lower portion of said double bent heat conductor makes direct contact with substantially an entire top surface of said heat generating body, and coupling the upper portion of said double bent heat conductor directly to said heat dissipating part by extending said upper portion of said double bent heat conductor beyond an end portion of said heat generating body.

2. The heat transfer mechanism as set forth in claim 1 wherein said elastic member is comprised of a polymer-based member.

3. The heat transfer mechanism as set forth in claim 1 wherein bonding members are used for interconnecting said heat generating body, said film-shaped heat conductor, said elastic member, and said heat dissipating part.

4. The heat transfer mechanism as set forth in claim 1 , further provided with tight fixing means for clamping said heat generating body, said film-shaped heat conductor, and said elastic member between a board mounting said heat generating body and a heat diffusion plate forming said heat dissipating part.

5. A heat dissipation system dissipating heat generated from heat generating bodies mounted, at their bottom surfaces, on a common board through a heat transfer mechanism to a common heat dissipating part, wherein:

said heat transfer mechanism comprises, for each heat generating body, a film-shaped heat conductor transferring heat from a top surface of a heat generating body to said heat dissipating part and an elastic member directly coupled with said heat dissipating part, the length of which is shorter than the length of the surface of said heat generating body, for imparting elasticity to said film-shaped heat conductor,

said film-shaped heat conductor is formed from a metal foil-type flexible heat pipe, and

said film-shaped heat conductor has a double bent shape of two parallel legs connected by a middle portion that offsets the two parallel legs with obtuse angles and transfers heat from the top surface of the heat generating body to the heat dissipating part along the double bent heat conductor by sandwiching the lower portion of said double bent heat conductor between said heat generating body and said elastic member so that said lower portion of said double bent heat conductor makes direct contact with substantially an entire top surface of said heat generating body, and coupling directly the upper portion of said double bent heat conductor to said heat dissipating part, by extending said upper portion of said double bent heat conductor beyond an end portion of said heat generating body.

6. A communication apparatus provided with heat generating bodies constituted by IC packages and with a heat dissipation system as set forth in claim 5 for dissipating heat from said heat generating bodies.