High dielectric film and related method of manufacture
A method of forming a high dielectric film for a semiconductor device comprises supplying a first source gas to a reaction chamber during a first time interval, supplying a first reactant gas to the reaction chamber during a second time interval after the first time interval, supplying a second source gas to the reaction chamber for a third time interval after the second time interval, supplying a second reactant gas to the reaction chamber for a fourth time interval after the third time interval, and supplying an additive gas including nitrogen to the reaction chamber during a fifth time interval.
1. A method of forming a high dielectric film by atomic layer deposition (ALD), the method comprising:
supplying a first source gas to a reaction chamber during a first time interval;
supplying a first reactant gas to the reaction chamber during a second time interval after the first time interval;
supplying a second source gas to the reaction chamber for a third time interval after the second time interval;
supplying a second reactant gas to the reaction chamber for a fourth time interval after the third time interval; and,
supplying an additive gas including nitrogen to the reaction chamber during a fifth time interval.
2. The method of claim 1 , wherein the fifth time interval is between the first and second time intervals.
3. The method of claim 1 , wherein the fifth time interval is between the second and third time intervals.
4. The method of claim 1 , wherein the fifth time interval is between the third and fourth time intervals.
5. The method of claim 1 , wherein the fifth time interval is after the fourth time interval.
6. The method of claim 1 , further comprising: supplying the additive gas to the reaction chamber during a sixth time interval after the third time interval; and,
wherein the fifth time interval is between the first and third time intervals.
7. The method of claim 1 , wherein the fifth time interval is substantially the same as one of the first through fourth time intervals.
8. The method of claim 1 , further comprising:
supplying a purge gas to the reaction chamber to purge residual gases following one of the first through fifth time intervals.
9. The method of claim 1 , wherein the first source gas comprises a precursor comprising at least one element selected from a group consisting of hafnium (Hf), zirconium (Zr), lanthanum (La), tantalum (Ta), strontium (Sr), and titanium (Ti).
10. The method of claim 1 , wherein the first source gas comprises a hafnium (Hf) precursor in which Hf is bonded with oxygen, carbon, hydrogen, chlorine, or nitrogen.
11. The method of claim 1 , wherein the first and second reactant gases comprise oxidant gases including oxygen.
12. The method of claim 1 , wherein the additive gas comprises a material selected from a group consisting of NH 3 gas, N 2 O gas, NO gas, and NH 3 plasma.
13. The method of claim 1 , wherein the second source gas comprises a precursor including silicon (Si), titanium (Ti), or aluminum (Al).
14. The method of claim 1 , wherein the high dielectric film comprises a single layer of nitrogen added to a layer comprising HfSiO, ZrSiO, LaSiO, HfTaO, TaTiO, SrTiO 3 , TiAIO, HfAIO or HfTiO.
15. The method of claim 6 ,
wherein the fifth time interval is between the first and second time intervals; and the sixth time interval is between the third and fourth time intervals.
16. The method of claim 6 ,
wherein the fifth time interval is between the first and second time intervals; and the sixth time interval is after the fourth time interval.
17. The method of claim 6 , wherein the fifth time interval is between the second and third time intervals; and the sixth time interval is between the third and fourth time intervals.
18. The method of claim 6 , wherein the fifth time interval is between the second and third time intervals; and the sixth time interval is after the fourth time interval.
19. The method of claim 8 , wherein the purge gas is supplied to the reaction chamber before the third time interval.
20. The method of claim 8 , wherein the purge gas is supplied to the reaction chamber between each of the first through fifth time intervals and after the fifth time interval.
21. The method of claim 8 , wherein the purge gas comprises argon (Ar), helium (He), or nitrogen gas (N 2 ).
22. The method of claim 10 , wherein the Hf precursor comprises an element selected from the group consisting of Hf[N(CH 3 ) 2 ] 4 , Hf[N(C 2 H 5 ) 2 ] 4 , Hf[N(C 2 H 5 )CH 3 ] 4 , Hf[OC(CH 3 ) 3 ] 4 and HfCl 4 .
23. The method of claim 11 , wherein each of the first and second reactant gases comprises a material selected from the group consisting of O 3 , H 2 O, H 2 O 2 , CH 3 OH, C 2 H 5 OH, and C 3 H 7 OH.
24. The method of claim 13 , wherein the second source gas comprises a silicon (Si) precursor in which Si is bonded with oxygen, carbon, hydrogen, or nitrogen.
25. The method of claim 24 , wherein the Si precursor comprises a material selected from a group consisting of SiH[N(CH 3 ) 2 ] 3 , Si[N(CH 3 ) 2 ] 4 , H 2 N(CH 2 ) 3 Si(OC 2 H 5 ) 3 , Si[N(CH 3 )C 2 H 5 ] 4 , and HSi[N(C 2 H 5 ) 2 ] 3 .
26. The method of claim 14 , further comprising:
adjusting the duration of the fifth time interval and the quantity of additive gas supplied to the reaction chamber to control the nitrogen content of the high dielectric film.
27. A method of fabricating a semiconductor device, the method comprising:
forming a high dielectric film on a semiconductor substrate located in a reaction chamber, wherein forming the dielectric film comprises:
supplying a first source gas to the reaction chamber during a first time interval;
supplying a first reactant gas to the reaction chamber during a second time interval after the first time interval;
supplying a second source gas to the reaction chamber for a third time interval after the second time interval;
supplying a second reactant gas to the reaction chamber for a fourth time interval after the third time interval; and,
supplying an additive gas including nitrogen to the reaction chamber during a fifth time interval; and,
forming a gate electrode material on the high dielectric film; and,
etching the gate electrode material and the high dielectric film to form a gate structure.
28. The method of claim 27 , wherein the gate electrode material comprises a conductive layer doped with impurity ions.
29. The method of claim 28 , wherein the gate electrode material comprises a polysilicon layer.
30. A method of fabricating a semiconductor device, the method
comprising: forming a lower electrode on a semiconductor substrate;
forming a high dielectric film on the lower electrode, wherein forming the high dielectric film comprises:
supplying a first source gas to a reaction chamber during a first time interval;
supplying a first reactant gas to the reaction chamber during a second time interval after the first time interval;
supplying a second source gas to the reaction chamber for a third time interval after the second time interval;
supplying a second reactant gas to the reaction chamber for a fourth time interval after the third time interval; and,
supplying an additive gas including nitrogen to the reaction chamber during a fifth time interval; and,
forming an upper electrode on the high dielectric film.
31. The method of claim 30 , wherein the upper electrode and the lower electrode comprise conductive layers doped with impurity ions.