Method of monitoring a semiconductor manufacturing trend

1. A method of monitoring trends in semiconductor processes, the method comprising:

assigning lot values to each of a set of wafer lots prior to performing semiconductor processes on the set of wafer lots, wherein the lot values have an increasing sequential order corresponding to an order in which the set of wafer lots are started in a beginning of the semiconductor processes;

after at least some of the semiconductor processes, testing at least some of the wafer lots to generate a set of test data; and

calculating a degree of scrambling for the set of wafer lots already tested, the calculating of the degree of scrambling comprising by subtracting a lot value from a largest lot value in the first data set;

after a current wafer lot of the set of wafer lots is tested, calculating a current scrambling value by subtracting the lot value of the current wafer lot from a maximum lot value of the lot values assigned for the set of wafer lots to yield the current scrambling value;

storing the current scrambling value into a set of scrambling values for the set of wafer lots, wherein the lot values include an average of a set of parameter values selected from the group consisting of moving average, and exponential weighted moving average; and

determining a current adjusted maximum scrambling value by multiplying a selected multiplier value with a current maximum scrambling value of the set of scrambling values for a selected number of wafer lots.

2. The method of claim 1 , further comprising:

determining a current number of lots of the set of wafer lots that should be included into a current moving average for monitoring a trend of one or more test results of the test data by using the current adjusted maximum scrambling value as the current number of lots included into the current moving average.

3. The method of claim 2 , wherein the selected number of wafer lots is a number of wafer lots tested for a selected period of time prior to the testing of the current wafer lot.

4. The method of claim 1 , wherein the testing uses one or more electrical tests.

5. The method of claim 1 , further comprising:

comparing the current scrambling value to a threshold scrambling value; and

if the current scrambling value is less than the threshold scrambling value, classifying the current wafer lot as a high priority wafer lot.

6. The method of claim 5 , further comprising performing a notifying action if the current wafer lot is classified as a high priority wafer lot.

7. The method of claim 5 , wherein the threshold scrambling value is a moving average of the scrambling values.

8. The method of claim 5 , wherein the method further comprises applying high priority evaluation and/or monitoring rules to the current wafer lot if the current wafer lot is classified as a high priority wafer lot.

9. The method of claim 1 , wherein the assigning of the lot values comprises converting an original lot value to a number, wherein the original lot value comprises at least one alphabetic character and at least one numeric character.

10. A method of monitoring trends in semiconductor processes, the method comprising:

assigning lot values to each of a set of wafer lots prior to performing semiconductor processes on the set of wafer lots, wherein the lot values have an increasing sequential order corresponding to an order in which the set of wafer lots are started in a beginning of the semiconductor processes;

after at least some of the semiconductor processes, testing at least some of the wafer lots using one or more electrical tests to generate a set of electrical test data; and

calculating a degree of scrambling for determining a current number of lots of the set of wafer lots that should be included into a current moving average for monitoring a trend of one or more test results of the set of electrical test data by subtracting a lot value from a largest lot value in the first data set, wherein the average of the set of parameter values is selected from the group consisting of moving average, and exponential weighted moving average, the calculating of the degree of scrambling comprising:

after a current wafer lot of the set of wafer lots is tested using the one or more electrical tests, calculating a current scrambling value by subtracting the lot value of the current wafer lot from a maximum lot value of the lot values assigned for the set of wafer lots to yield the current scrambling value;

storing the current scrambling value into a set of scrambling values for the set of wafer lots; and

determining a current adjusted maximum scrambling value by multiplying a selected multiplier value with a current maximum scrambling value of the set of scrambling values for a selected number of wafer lots.

11. The method of claim 10 , further comprising:

comparing the current scrambling value to a threshold scrambling value; and

if the current scrambling value is less than the threshold scrambling value, classifying the current wafer lot as a high priority wafer lot.

12. The method of claim 11 , further comprising performing a notifying action if the current wafer lot is classified as a high priority wafer lot.

13. The method of claim 11 , wherein the method further comprises applying high priority evaluation and/or monitoring rules to the current wafer lot if the current wafer lot is classified as a high priority wafer lot.

14. A method of monitoring integrated circuit manufacturing comprising:

manufacturing wafer lots, comprising:

assigning a first lot value to a first wafer lot, storing the first lot value in a first data set, assigning a second lot value to a second wafer lot, and storing the second lot value in the first data set, wherein the second lot value is greater than the first lot value by an incremental unit value, and wherein starting manufacturing of the second wafer lot occurs after starting manufacturing of the first wafer lot;

performing a wafer electrical test on the first wafer lot;

calculating a scrambling value for the first wafer lot by subtracting a lot value from a largest lot value in the first data set;

storing the scrambling value in a second data set, wherein the scrambling value is the first wafer lot value subtracted from a largest lot value in the first data set;

calculating a maximum scrambling value, wherein the maximum scrambling value is a currently largest scrambling value in the second data set scaled by a predetermined scaling factor;

obtaining a parameter value from the first wafer lot;

storing the parameter value in a third data set;

calculating a parameter moving average value, wherein the parameter moving average value is an average of a selected number of the parameter values from the third data set, wherein the average of the set of parameter values is selected from the group consisting of moving average, and exponential weighted moving average, the selected number of parameter values being the maximum scrambling value, and the selected number of the parameter values are from the wafer lots most recently tested;

storing the parameter moving average value in a fourth data set; and

applying a statistical process control rule to a set of parameter moving average values in the fourth data set.

15. The method of claim 14 , wherein the method further comprises performing a notifying action if one or more values in the fourth data set is non-conforming to the statistical process control rule.

16. The method of claim 14 , wherein the assigning the first lot value to the first wafer lot comprises converting an initial first lot value of the first wafer lot to a modified first lot value, wherein the initial first lot value includes characters selected from the group consisting of alphabetic character, numeric character, and combinations thereof.

17. The method of claim 14 , wherein the predetermined scaling factor accounts for additional scrambling occurring during the manufacturing process.

18. The method of claim 14 , wherein the predetermined parameter is selected from the group consisting of IDDQ, power, output voltage, output current, chip functionality, capacitance-voltage, and combinations thereof.

19. The method of claim 14 , wherein the statistical process rule is selected from the group consisting of Western Electric rule, Shewhart rule, and combinations thereof.

20. The method of claim 1 , further comprising:

calculating a maximum scrambling value, wherein the maximum scrambling value is a currently largest scrambling value in the second data set scaled by a predetermined scaling factor; and

selecting the predetermined parameter from the group consisting of IDDQ, power, output voltage, output current, chip functionality, capacitance-voltage, and combinations thereof.