Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor
A pad for CMP operations includes a guide plate having a plurality of holes therein and being affixed to a compressible under-layer; and a plurality of pressure-sensing and process monitoring polishing elements each affixed to the compressible under-layer and passing through a corresponding hole in the guide plate so as to be maintained in a substantially vertical orientation with respect to the compressible under-layer but being translatable in a vertical direction with respect to the guide plate.
1. A polishing pad assembly, comprising:
a guide plate having a plurality of holes therein and being affixed to a compressible under-layer; and
a plurality of polishing elements, at least one of which includes pressure monitoring sensors and each polishing element is affixed to the compressible under-layer and passing through a corresponding hole in the guide plate so as to be maintained in a substantially vertical orientation with respect to the compressible under-layer but being translatable in a vertical direction with respect to the guide plate in order to contact and polish workpiece.
2. The pad of claim 1 , wherein at least one of the polishing elements have circular cross sections.
3. The pad of claim 1 , wherein at least one of the polishing elements have triangular cross sections.
4. The pad of claim 1 , wherein the polishing elements are made from cast or molded polyurethane.
5. The pad of claim 1 , further comprising a slurry distribution material fastened to the guide plate by an adhesive.
6. The pad of claim 1 , wherein at least one of the polishing elements are configured for process monitoring.
7. The pad of claim 6 , wherein at least one of the polishing elements configured for process monitoring are made of an optically transparent material.
8. The pad of claim 6 , wherein at least one of the polishing elements configured for process monitoring include pressure sensors.
9. The pad of claim 6 , wherein at least one of the polishing elements configured for include a capacitive or eddy current sensor embedded therein.
10. The pad of claim 6 , wherein at least one of the polishing elements configured for process monitoring include a conductive or optically transparent core.
11. The pad of claim 6 , wherein at least one of the polishing elements configured for process monitoring include a conductive core and shell with both conducting components separated by insulating material.
12. The pad of claim 6 , wherein at least one of the polishing elements configured for process monitoring are encased in another material.
13. The pad of claim 6 , wherein at least one of the polishing elements configured for process monitoring include temperature sensors.
14. A polishing pad assembly comprising:
a guide plate having a plurality of holes therein and being affixed to a compressible under-layer; and
a plurality of process monitoring polishing elements each affixed to the compressible under-layer and passing through a corresponding hole in the guide plate so as to be maintained in a substantially vertical orientation with respect to the compressible under-layer but being translatable in a vertical direction with respect to the guide plate in order to contact and polish workpiece.
15. The pad of claim 14 , wherein at least one of the process monitoring polishing elements are made of an optically transparent material.
16. The pad of claim 14 , wherein at least one of the process monitoring polishing elements include pressure sensors.
17. The pad of claim 14 , wherein at least one of the process monitoring polishing elements include a capacitive or eddy current sensor embedded therein.
18. The pad of claim 14 , wherein at least one of the process monitoring polishing elements include a conductive or optically transparent core.
19. The pad of claim 14 , wherein at least one of the process monitoring polishing elements include a conductive core and shell with both conducting components separated by insulating material.
20. The pad of claim 14 , wherein at least one of the process monitoring polishing elements are encased in another material.
21. The pad of claim 14 , further comprising a slurry distribution material fastened to the guide plate by an adhesive.