Memory module and heat sink arrangement
A memory module and heat sink arrangement is disclosed to include a memory module, two heat sinks attached to two opposite sides of a memory chip of the memory module, each heat sink having a mounting unit at a top side and multiple retaining spring strips suspending below the mounting unit, and multiple clamps respectively clamped on the two heat sinks and engaged with the retaining spring strips of the two heat sinks and respectively stopped between guide blocks at the two heat sinks to hold respective locating plugs of one of the two heat sinks in engagement with respective locating grooves of the other of the two heat sinks.
1. A memory module and heat sink arrangement comprising two heat sinks, a memory module sandwiched between said two heat sinks and carrying a memory chip, and a plurality of clamps that secure said two heat sinks together, wherein said two heat sinks each comprise a flat base, a bonding surface formed on said flat base at an inner side and bonded to one of two opposite sides of said memory chip, a mounting unit disposed at a top side of said flat base, and a plurality of retaining spring strips respectively extended from said flat base for securing said clamps, said mounting unit of one of said heat sinks being connectable to said mounting unit of the other of said heat sinks; said clamps are clamped on said two heat sinks at a top side, said clamps each having two clamping arms respectively clamped on one retaining spring strip of each of said two heat sinks, said clamping arms each having a retaining hole for the engagement of the associating retaining spring strip, wherein said flat base of each of said two heat sinks has a plurality of openings; said retaining spring strips of said two heat sinks are respectively suspended in said openings on said flat base of each of said two heat sinks.
2. The memory module and heat sink arrangement as claimed in claim 1 , wherein said mounting unit of each of said two heat sinks comprises a plurality of locating plugs and a plurality of locating grooves, said locating plugs of said mounting unit of one of said two heat sinks being respectively engaged into said locating grooves of said mounting unit of the other of said two heat sinks.
3. The memory module and heat sink arrangement as claimed in claim 2 , wherein said mounting unit of each of said two heat sinks further comprises a plurality of bearing blocks respectively disposed above said respective locating grooves, said bearing blocks of said mounting unit of one of said two heat sinks being respectively stopped against said locating plugs of said mounting unit of the other of said two heat sinks at a top side.
4. The memory module and heat sink arrangement as claimed in claim 1 , wherein said two heat sinks each further comprise a plurality of stop blocks respectively protruded from said respective flat base at two sides for stopping said memory module in between said two heat sinks.
5. The memory module and heat sink arrangement as claimed in claim 1 , wherein said retaining spring strips each have a free end terminating in a guide slope and then a retaining tip, said retaining tip being adapted to engage said retaining hole of said one clamping arm of one of said clamps, said guide slope being adapted to guide said retaining hole of said one clamping arm of one of said clamps into engagement with said retaining tip.
6. The memory module and heat sink arrangement as claimed in claim 1 , wherein said two heat sinks each further comprises multiple pairs of guide blocks respectively protruded from said flat base of each of said two heat sinks at two sides of each of said retaining spring strips.
7. The memory module and heat sink arrangement as claimed in claim 1 , further comprising a heat transfer compound applied to said bonding surface of said flat base of each of said two beat sinks.