Cleaning system utilizing an organic cleaning solvent and a pressurized fluid solvent
A cleaning system that utilizes an organic cleaning solvent and pressurized fluid solvent is disclosed. The system has no conventional evaporative hot air drying cycle. Instead, the system utilizes the solubility of the organic solvent in pressurized fluid solvent as well as the physical properties of pressurized fluid solvent. After an organic solvent cleaning cycle, the solvent is extracted from the textiles at high speed in a rotating drum in the same way conventional solvents are extracted from textiles in conventional evaporative hot air dry cleaning machines. Instead of proceeding to a conventional drying cycle, the extracted textiles are then immersed in pressurized fluid solvent to extract the residual organic solvent from the textiles. This is possible because the organic solvent is soluble in pressurized fluid solvent. After the textiles are immersed in pressurized fluid solvent, pressurized fluid solvent is pumped from the drum. Finally, the drum is de-pressurized to atmospheric pressure to evaporate any remaining pressurized fluid solvent, yielding clean, solvent free textiles. The organic solvent is preferably selected from terpenes, halohydrocarbons, certain glycol ethers, polyols, ethers, esters of glycol ethers, esters of fatty acids and other long chain carboxylic acids, fatty alcohols and other long-chain alcohols, short-chain alcohols, polar aprotic solvents, siloxanes, hydrofluoroethers, dibasic esters, and aliphatic hydrocarbons solvents or similar solvents or mixtures of such solvents and the pressurized fluid solvent is preferably densified carbon dioxide.
1. A process for cleaning substrates, the process comprising:
(a) placing the substrates in a pressurizable vessel under non-pressurized conditions;
(b) adding organic solvent to the pressurizable vessel;
(c) agitating the substrates in the vessel under non-pressurized conditions;
(d) separating a portion of the organic solvent from the substrates;
(e) pressurizing the pressurizable vessel and adding pressurized fluid solvent thereto;
(f) removing a first portion of the pressurized fluid solvent from the pressurized vessel; and
(g) depressurizing the vessel to vaporize a remaining portion of the pressurized fluid solvent; wherein the organic solvent is of formula C n H j X k O b wherein:
2≦n≦20;
0≦j, k≦(2n+2);
2n−4≦(j+k)≦2n+2;
1≦b≦6; and
each X is independently F, Cl, Br or I.
2. The process of claim 1 wherein the pressurized fluid solvent comprises liquid carbon dioxide at subcritical condition.
3. The process of claim 1 wherein steps (b)-(d) are performed multiple times prior to step (e).
4. The process of claim 1 wherein separating step (d) comprises agitating or rotating the substrates in a perforated drum or wheel.
5. The process of claim 1 wherein the organic solvent has a flashpoint greater than 100° F.
6. The process of claim 1 wherein n=4, j=8, b=3 and k=0.
7. The process of claim 1 wherein n=5, j=10, b=3 and k=0.
8. The process of claim 1 wherein n=6, j=12, b=3 and k=0.
9. The process of claim 1 wherein n=7, j=14, b=3 and k=0.
10. The process of claim 1 wherein the substrates comprises flexible substrates.
11. A process for cleaning substrates, the process comprising:
(a) placing the substrates in a non-pressurized cleaning vessel;
(b) adding organic solvent to the non-pressurized cleaning vessel;
(c) agitating the substrates in the cleaning vessel under non-pressurized conditions;
(d) separating a portion of the organic solvent from the substrates;
(e) transferring the substrates to a pressurizable vessel;
(f) pressurizing the pressurizable vessel and adding pressurized fluid solvent thereto;
(g) removing a portion of the pressurized fluid solvent from the pressurizable vessel; and
(h) depressurizing the pressurizable vessel to vaporize a remaining portion of the pressurized fluid solvent; wherein the organic solvent is of formula C n H j X k O b wherein:
2≦n≦20;
0≦j, k≦(2n+2);
2n−4≦(j+k)≦2n+2;
1≦b≦6; and
each X is independently F, Cl, Br or I.
12. The process of claim 11 wherein the pressurized fluid solvent comprises carbon dioxide at subcritical condition.
13. The process of claim 11 wherein steps (b)-(d) are performed multiple times prior to step (e).
14. The process of claim 13 wherein said performance of steps (b)-(d) multiple times occurs in the same or different cleaning vessel.
15. The process of claim 14 wherein steps (b)-(d) are performed multiple times using a same batch or a different batch of the organic solvent.
16. The process of claim 11 wherein separating step (d) comprises agitating or rotating the substrates in a perforated drum or wheel.
17. The process of claim 11 wherein the organic solvent has a flashpoint greater than 100° F.
18. The process of claim 11 wherein n=4, j=8, b=3 and k=0.
19. The process of claim 11 wherein n=5, j=10, b=3 and k=0.
20. The process of claim 11 wherein n=6, j=12, b=3 and k=0.
21. The process of claim 11 wherein n=7, j=14, b=3 and k=0.
22. The process of claim 11 wherein the substrates comprises flexible substrates.
23. A process for cleaning flexible substrates, the process comprising:
(a) placing the flexible substrates in a non-pressurized cleaning vessel;
(b) adding organic solvent to the non-pressurized cleaning vessel;
(c) agitating the flexible substrates in the cleaning vessel under non-pressurized conditions;
(d) separating a portion of the organic solvent from the flexible substrates;
(e) transferring the flexible substrates to a pressurizable vessel;
(f) pressurizing the pressurizable vessel and adding pressurized fluid solvent thereto;
(g) removing a portion of the pressurized fluid solvent from the pressurizable vessel; and
(h) depressurizing the pressurizable vessel to vaporize a remaining portion of the pressurized fluid solvent; wherein the organic solvent has a flashpoint greater than 100° F. and is of formula C n H j X k O b wherein n=4, j=8, b=3 and k=0.
24. A process for cleaning flexible substrates, the process comprising:
(a) placing the flexible substrates in a non-pressurized cleaning vessel;
(b) adding organic solvent to the non-pressurized cleaning vessel;
(c) agitating the flexible substrates in the cleaning vessel under non-pressurized conditions;
(d) separating a portion of the organic solvent from the flexible substrates by agitating or rotating the flexible substrates in a perforated drum or wheel;
(e) transferring the flexible substrates to a pressurizable vessel;
(f) pressurizing the pressurizable vessel and adding pressurized fluid solvent thereto;
(g) removing a portion of the pressurized fluid solvent from the pressurizable vessel; and
(h) depressurizing the pressurizable vessel to vaporize a remaining portion of the pressurized fluid solvent; wherein the organic solvent has a flashpoint greater than 100° F. and is of formula C n H j X k O b wherein n=5, j=10, b=3 and k=0.
25. A process for cleaning flexible substrates, the process comprising:
(a) placing the flexible substrates in a non-pressurized cleaning vessel;
(b) adding organic solvent to the non-pressurized cleaning vessel;
(c) agitating the flexible substrates in the cleaning vessel under non-pressurized conditions;
(d) separating a portion of the organic solvent from the flexible substrates;
(e) transferring the flexible substrates to a pressurizable vessel;
(f) pressurizing the pressurizable vessel and adding pressurized fluid solvent thereto;
(g) removing a portion of the pressurized fluid solvent from the pressurizable vessel; and
(h) depressurizing the pressurizable vessel to vaporize a remaining portion of the pressurized fluid solvent; wherein the organic solvent has a flashpoint greater than 100° F. and is of formula C n H j X k O b wherein n=6, j=12, b=3 and k=0.
26. A process for cleaning flexible substrates, the process comprising:
(a) placing the flexible substrates in a non-pressurized cleaning vessel;
(b) adding organic solvent to the non-pressurized cleaning vessel;
(c) agitating the flexible substrates in the cleaning vessel under non-pressurized conditions;
(d) separating a portion of the organic solvent from the flexible substrates;
(e) transferring the flexible substrates to a pressurizable vessel;
(f) pressurizing the pressurizable vessel and adding pressurized fluid solvent thereto;
(g) removing a portion of the pressurized fluid solvent from the pressurizable vessel; and
(h) depressurizing the pressurizable vessel to vaporize a remaining portion of the pressurized fluid solvent; wherein the organic solvent has a flashpoint greater than 100° F. and is of formula C n H j X k O b wherein n=7, j=14, b=3 and k=0.