Camera module with first and second image sensor chips, holders and lens
The present invention relates to a camera module and a manufacturing method thereof, in which both front and rear directions can be provided by improving the disadvantage of the existing camera module providing only one direction photographing. According to an embodiment of the present invention, the camera module includes first and second image sensor chips whose rear surfaces are adhered by a nonconductive bonding agent so that image region parts face opposite directions, a substrate that is connected to the first image sensor chip using bumps for signal connection and connected to the second image sensor chip using wires for signal connection, a through-hole being formed in the substrate under a region in which the first image sensor chip is mounted, an infrared-shielding filter installed in the through-hole of the substrate, first and second holders disposed on upper and lower sides of the substrate, and first and second lens disposed in the first and second holders, respectively.
1. A camera module, comprising:
first and second image sensor chips whose rear surfaces are adhered by a nonconductive bonding agent so that image region parts face opposite directions;
a substrate that is connected to the first image sensor chip using bumps for signal connection and connected to the second image sensor chip using wires for signal connection, a through-hole being formed in the substrate under a region in which the first image sensor chip is mounted;
an infrared-shielding filter installed in the through-hole of the substrate;
first and second holders disposed on upper and lower sides of the substrate; and
first and second lens disposed in the first and second holders, respectively.