Semiconductor device group and method for fabricating the same, and semiconductor device and method for fabricating the same
The semiconductor group comprises a first semiconductor device including a first design macro and a nonvolatile memory, and a second semiconductor device including a second design macro having identity with the first design macro and including no nonvolatile memory. The first design macro includes a first active region and a first device isolation region formed on a first semiconductor substrate. The second design macro includes a second active region and a second device isolation region formed on a second semiconductor substrate. A curvature radius of an upper end of the first active region in a cross section is larger than a curvature radius of an upper end of the second active region in a cross section. A difference in height between a surface of the first active region and a surface of the first device isolation region is larger than a difference in height between a surface of the second active region and a surface of the device isolation region.
1. A semiconductor device group comprising: a first semiconductor device including a first design macro and a nonvolatile memory, and a second semiconductor device including no nonvolatile memory and a second design macro having functions identical to those of the first design macro,
the first design macro including a first element which is formed on a first semiconductor substrate and includes a first active region, a first device isolation region and a first transistor formed in the first active region,
the second design macro including a second element which is formed on a second semiconductor substrate discrete from the first semiconductor substrate and includes a second active region, a second device isolation region and a second transistor having characteristics identical to those of the first transistor formed in the second active region,
a curvature radius of an upper end of the first active region in a cross section being larger than a curvature radius of an upper end of the second active region in a cross section, and
a difference in height between a surface of the first active region and a surface of the first device isolation region being larger than a difference in height between a surface of the second active region and a surface of the second device isolation region.
2. A semiconductor device group according to claim 1 , wherein
the curvature radius of the first active region is made larger than the curvature radius of the second active region so that a difference in a device characteristic due to the difference in height between the surface of the first active region and the surface of the first device isolation region being different from the difference in height between the surface of the second active region and the surface of the second device isolation region is compensated.
3. A semiconductor device group according to claim 2 , wherein
the device characteristic is a channel width dependency of a threshold voltages of a transistor.
4. A semiconductor device group according to claim 1 , wherein
the first device isolation region includes a trench formed in the first semiconductor substrate, and an insulating material buried in the trench, and
the second device isolation region includes a trench formed in the second semiconductor substrate, and an insulating material buried in the trench.
5. A semiconductor device group according to claim 1 , wherein
the first semiconductor device is an FPGA including the nonvolatile memory, and the second semiconductor device is an FPGA including no nonvolatile memory.
6. A semiconductor device group according to claim 1 , wherein
the first design macro and the second design macro constitute a main logic circuit.
7. The semiconductor device group according to claim 1 , wherein the first design macro and the non-volatile memory comprise 11 or more distinct transistor structures, and the second design macro comprises 6 or more distinct transistor structures.
8. The semiconductor device group according to claim 1 , wherein the first design macro comprises 6 or more distinct transistor structures formed within the first active region which have the same operational function as 6 or more distinct transistor structures of the second design macro formed in the second active region.
9. The semiconductor device group according to claim 1 , wherein
the first design macro constitutes a first main logic circuit region formed on the first semiconductor substrate, and
the second design macro constitutes a second main logic circuit region formed on the second semiconductor substrate.
10. The semiconductor device group according to claim 1 , wherein
the nonvolatile memory is a flash memory.
11. A semiconductor device comprising: a first design macro and a nonvolatile memory, the first design macro including a first element which is formed on a semiconductor substrate and includes a first active region, a first device isolation region and a first transistor formed in the first active region,
the semiconductor device constituting a semiconductor device group together with another semiconductor device which comprises no nonvolatile memory and a second design macro, the second design macro having functions identical to those of the first design, macro and including a second element which is formed on another semiconductor substrate discrete from the semiconductor substrate and includes a second active region, a second device isolation region and a second transistor having characteristics identical to those of the first transistor formed in the second active region,
a curvature radius of an upper end of the first active region in a cross section being larger than a curvature radius of an upper end of the second active region in a cross section, and
a difference in height between a surface of the first active region and a surface of the first device isolation region being larger than a difference in height between a surface of the second active region and a surface of the second device isolation region.