IP Library Granted Patent US 7,547,363
Granted Patent B2
US 7,547,363 · App. 10/865,880 · Granted Jun 16, 2009

Solid organometallic compound-filled container and filling method thereof

Assignee: Tosoh Finechem Corporation
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Quick Facts
Patent No.
US 7,547,363
App. No.
10/865,880
Granted
Jun 16, 2009
Kind
B2
Abstract

A solid organometallic compound novel filled container stably supplies an apparatus for vapor phase epitaxial growth such as an MOCVD apparatus with a solid organometallic compound over a long term. The solid organometallic compound-filled container has a carrier gas inlet and a carrier gas outlet. The interior of the filled container is separated into a plurality of vertical compartments. A carrier gas introduced via the carrier gas inlet flows through each of the vertical compartments and is then discharged via the carrier gas outlet.

Claims (14)

1. A solid organometallic compound-filled container comprising:

a container having an interior separated by at least one partition in a vertical direction such that said interior of said container comprises at least two vertically extending compartments;

a carrier gas inlet and a carrier gas outlet provided for said container for the supply of carrier gas to said container and the removal of carrier gas from said container;

at least one carrier gas flow direction inverter arranged in said container such that when the carrier gas is introduced via said carrier gas inlet, the carrier gas flows downward through each of said vertically extending compartments before being discharged through said carrier gas outlet; and

organometallic compound filled in each said compartment;

wherein said carrier gas flow direction inverter comprises a communicating channel, a lower opening and an upper opening such that carrier gas introduced through said carrier gas inlet flows through each of said plurality of vertical compartments inside said filled container to said carrier gas outlet;

said communicating channel is arranged such that carrier gas introduced through said carrier gas inlet is introduced through said lower opening and discharged through said upper opening of said communicating channel via an opening in each of said at least one partitions.

2. The solid organometallic compound-filled container of claim 1 , wherein:

a discharging channel has a lower opening for receiving the carrier gas from a lower part of the other of said vertical compartments having said carrier gas outlet and for discharging the carrier gas through said carrier gas outlet.

3. The solid organometallic compound-filled container of claim 2 , wherein:

said lower opening of said communicating channel is positioned at less than or equal to one third of the internal height of said filled container from the internal bottom of said filled container, and said upper opening of said communicating channel is positioned at more than or equal to two thirds of the internal height of said filled container from said internal bottom; and

said lower opening of said discharging channel is positioned at less than or equal to one third of the internal height of said filled container from said internal bottom.

4. The solid organometallic compound-filled container of claim 2 , further comprising a charging port for filling the solid organometallic compound into one of said plurality of vertical compartments.

5. The solid organometallic compound-filled container of claim 1 , wherein said solid organometallic compound is trimethylindium.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 10, 2004
From: TOMIYASU, SHIZUO; TOKUDOME, KOHICHI; HAGA, KENICHI
To: TOSOH FINECHEM CORPORATION
Reel/Frame 015686/0278 →
Priority Claims (2)
JP 2003-271742 · Jul 8, 2003 · national
JP 2003-273784 · Jul 11, 2003 · national
Continuity (1)
Related Publication 20050008799A1 · Jan 13, 2005