Wafer scale antenna module with a backside connectivity
View Patent ↗In one embodiment, wafer-scale antenna module is provided that includes: a substrate having a first surface and an opposing second surface; a plurality of conductive contact regions extending from the first surface into the substrate towards the second surface; active circuitry formed in the substrate adjacent the second surface, the active circuitry electrically coupled to the conductive contact regions; an insulating layer adjacent the first surface, the insulating layer forming a plurality of vias arranged corresponding to the plurality of conductive contact regions, each via forming an opening at the corresponding conductive contact region; and a plurality of antennas formed on the insulating layer corresponding to the plurality of vias; wherein each via contains an electrical conductor to electrically couple the corresponding contact region to the antenna corresponding to the via, whereby a resulting separation between the driving circuitry and the antennas aids an electrical isolation of the driving circuitry from the antennas.
1. A wafer-scale antenna module, comprising:
a substrate having a first surface and an opposing second surface;
a plurality of conductive contact regions extending from the first surface into the substrate towards the second surface;
active circuitry formed in the substrate adjacent the second surface, the active circuitry electrically coupled to the conductive contact regions;
an insulating layer adjacent the first surface, the insulating layer forming a plurality of vias arranged corresponding to the plurality of conductive contact regions, each via forming an opening at the corresponding conductive contact region; and
a plurality of antennas formed on the insulating layer corresponding to the plurality of vias; wherein each via contains an electrical conductor to electrically couple the corresponding contact region to the antenna corresponding to the via, whereby a resulting separation between the active circuitry and the antennas aids an electrical isolation of the active circuitry from the antennas.
2. The wafer-scale antenna module of claim 1 , wherein the substrate comprises silicon.
3. The integrated antenna of claim 1 , wherein the plurality of antennas comprise patch antennas.
4. The wafer-scale antenna module of claim 1 , wherein the plurality of antennas comprise dipole antennas.
5. The wafer-scale antenna module of claim 4 , wherein the plurality of dipole antennas comprise T-shaped dipole antennas.
6. The wafer-scale antenna module of claim 1 , further comprising:
a heat conducting layer formed adjacent the active circuitry.
7. The wafer-scale antenna module of claim 6 , wherein the heat-conducting layer is separated from the active circuitry by a first passivation layer.
8. The wafer-scale antenna module of claim 7 , wherein the plurality of antennas are covered by a second passivation layer.
9. The wafer-scale antenna module of claim 1 , wherein the conductive contact regions comprise diffusion-doped regions.
10. The wafer-scale antenna module of claim 1 , wherein the conductive contact regions comprise trenches filled with conductive material.
11. The wafer-scale antenna module of claim 10 , wherein the conductive material is doped polysilicon.
12. The wafer-scale antenna module of claim 1 , wherein the insulating layer is separated from the first surface by a conducting shield layer.
13. The wafer-scale antenna module of claim 1 , wherein the conductive contact regions extend between the first and second surfaces.
14. The wafer-scale antenna module of claim 1 , wherein the active circuitry forms groups of active devices, the wafer-scale antenna module further comprising laser-scribed isolation walls between the groups of active devices.