Substrate processing device
A substrate processing device is provided, which includes a resistance heating element and a high-frequency electrode, to which a voltage is applied, a power supply member for a resistance heating element, and a power supply member for a high-frequency electrode, which supply power to the resistance heating element and the high-frequency electrode, respectively, a peripheral member disposed close to circumferences of the power supply members, and heat insulators arranged between the power supply members and the peripheral member and having heat resistance to a temperature at least higher than 250° C.
1. A substrate processing device, comprising:
a ceramic base including at least one member to be supplied with power;
at least one power supply member, which applies a voltage to the member to be supplied with power, provided in the base;
a peripheral member disposed close to the power supply member;
a heat insulator surrounding a portion of the power supply member, disposed between the power supply member and the peripheral member, and having heat resistance to a temperature at least higher than 250° C.;
an insulating pipe surrounding another portion of the power supply member and which is separated from both the heat insulator and the peripheral member; and
a shaft supporting the ceramic base and comprising a hollow cylinder made of a material selected from the group consisting of aluminum nitride, silicon nitride and aluminum oxide;
wherein the peripheral member is provided on an inner circumferential surface of a lower end of the shaft;
wherein a lower end of the power supply member is fitted to the peripheral member through the heat insulating member; and
wherein at least a part of the peripheral member is disposed adjacent to the power supply member at a distance of 5 mm or less.
2. The substrate processing device according to claim 1 ,
wherein the member to be supplied with power is at least one of a resistance heating element and a high-frequency electrode.
3. The substrate processing device according to claim 1 , wherein a thermal conductivity of the heat insulator is 50 W/m·K or less.
4. The substrate processing device according to claim 1 , wherein the heat insulator is an electrical insulator.
5. The substrate processing device according to claim 4 , wherein the electrical insulator is a ceramic.
6. The substrate processing device according to claim 1 , wherein a withstand voltage of the heat insulator is 2 kV or more.