Temperature characteristic inspection device
Optoelectronic properties of optical communication LEDs, LDs and PDs should be examined in a wide range of temperatures between −40° C. and +85° C. Low temperature photocharacteristics of as-chip devices are tested by preparing an inspection stage cooled at a low temperature encapsulated in a shield casing with a front opening, conveying a chip of LD, LED or PD by a collet via the opening, placing the chip on the cold stage, blowing the stage and chip with cool dry air for preventing the chip from wetting, touching the chip by a probe, applying a current/voltage to the chip, examining emission/detection of the chip and taking the chip off via the opening by the collet.
1. A temperature characteristic inspection device comprising:
an inspection stage for sustaining a light emitting device chip or a light receiving device chip;
a cooling device for cooling the inspection stage;
a coolant supplying/exhausting device having a coolant inlet tube for introducing a liquid coolant and a coolant outlet tube for exhausting warmed liquid coolant for cooling the cooling device;
a shield casing encapsulating the inspection stage, the cooling device, a part of the coolant inlet tube and a part of the coolant outlet tube joining the cooling device;
a dry-air chamber following a rear of the shield casing for introducing and accommodating dry air temporarily;
a dry-air path produced in the shield casing;
a dry-air rectifying plate fitted on a front of the dry-air chamber for supplying the dry-air path in the shield casing with a laminar flow of dry air from the dry-air chamber;
an opening perforated at a front upper part of the shield casing for exhausting dry air and for allowing the chip to go in or go out therethrough;
a collet for fetching an unexamined chip onto the inspection stage and for taking an examined chip off from the inspection stage via the opening;
a probe for coming via the opening in contact with an electrode of the unexamined chip to supply a current or a voltage to the chip; and
a photocharacteristic examining device for detecting light emitted from the chip or irradiating the chip with a test beam and measuring a photocurrent induced;
wherein the dry-air path has a section having a shape and a size identical to a shape and a size of the dry-air rectifying plate, the opening has a section smaller than the section of the dry-air path, photocharacteristics of the light emitting device chips or the light receiving device chips are examined by chucking the chip by the collet, conveying the chip via the opening into the shield casing, laying the chip on the inspection stage, bringing the probe into contact with an electrode of the chip, blowing cool dry air to the chip, examining photocharacteristics of the chip, chucking the chip by the collet and taking the chip off by the collet from the inspection stage via the opening.
2. The temperature characteristic inspection device as claimed in claim 1 , wherein the inspecting stage for sustaining a light emitting device chip or a light receiving device chip is positioned in a downstream of the dry air path beginning from the dry-air rectifying plate and being formed in the shield casing, the inspection stage is positioned close to the opening, the dry-air path has a section having a shape and a size identical to a shape and a size of the dry-air rectifying plate, the opening has a section smaller than the section of the dry-air path, photocharacteristics of the light emitting device chips or the light receiving device chips are examined by chucking the chip by the collet, conveying the chip via the opening into the shield casing, laying the chip on the inspection stage, bringing the probe into contact with an electrode of the chip, blowing cool dry air to the chip, examining photocharacteristics of the chip, chucking the chip by the collet and taking the chip off by the collet from the inspection stage via the opening.
3. The temperature characteristic inspection device as claimed in claim 1 , wherein the coolant inlet tube and the coolant outlet tube pierce the dry-air chamber, and the dry air is cooled by exchanging heat between the coolant and dry air in the dry-air chamber.
4. The temperature characteristic inspection device as claimed in claim 1 , wherein the dry-air rectifying plate capable of supplying dry air into the dry-air path in the shield casing is a porous plate.
5. The temperature characteristic inspection device as claimed in claim 1 , wherein a velocity of the dry air in the dry-air path in the shield casing is less than 0.5 m/sec.
6. The temperature characteristic inspection device as claimed in claim 1 , wherein the cooling device for cooling the inspection stage is a Peltier element and a heat-exchange block, the heat-exchange block is cooled by the coolant, and the Peltier element is sandwiched between a side of the heat-exchange block and a side of the inspection stage.
7. The temperature characteristic inspection device as claimed in claim 6 , wherein the coolant inlet tube of supplying the coolant for eliminating heat produced in the Peltier element and the coolant outlet tube for exhausting the coolant penetrate the dry-air chamber and extend to the heat-exchange block.
8. The temperature characteristic inspection device as claimed in claim 1 , wherein the shield casing for separating dry air from external air is lined with a porous material for heat-insulation.
9. The temperature characteristic inspection device as claimed in claim 1 , wherein discharge holes are perforated at a top of the shield casing in a direction vertical to the dry-air path for discharging dry air.
10. The temperature characteristic inspection device as claimed in claim 1 , wherein the opening is separated into a top opening for conveying a chip into or out of the shield casing and a front opening for allowing light to pass.
11. The temperature characteristic inspection device as claimed in claim 10 , wherein the opening is separated into a top opening for conveying a chip into or out of the shield casing and a front opening for allowing light to pass, and the shield casing is furnished with a sliding cover for covering the top opening at the inspection and for discovering the top opening at the chip exchange.