IP Library › Granted Patent US 7,565,001
Granted Patent B2
US 7,565,001 · App. 12/139,315 · Granted Jul 21, 2009

System and method of providing mask defect printability analysis

Assignee: Synopsys, Inc.
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Quick Facts
Patent No.
US 7,565,001
App. No.
12/139,315
Granted
Jul 21, 2009
Kind
B2
Abstract

A simulated wafer image of a physical mask and a defect-free reference image are used to generate a severity score for each defect, thereby giving a customer meaningful information to accurately assess the consequences of using a mask or repairing that mask. The defect severity score is calculated based on a number of factors relating to the changes in critical dimensions of the neighbor features to the defect. A common process window can also be used to provide objective information regarding defect printability. Certain other aspects of the mask relating to mask quality, such as line edge roughness and contact corner rounding, can also be quantified by using the simulated wafer image of the physical mask.

Claims (68)

1. A method of generating a defect severity score report for a physical mask, the method comprising:

using a mask inspection system,

identifying a defect on a simulated wafer image of the physical mask;

identifying a corresponding area on a simulated wafer image of a reference mask, the reference mask corresponding to a defect-free physical mask;

identifying a set of neighbor features proximate to the defect on the simulated wafer image of the physical mask;

identifying a corresponding set of neighbor features on the simulated wafer image of the reference mask;

measuring critical dimensions (CDs) for predetermined defect-free features on the simulated wafer image of the physical mask at different exposures;

measuring CDs for corresponding predetermined defect-free features on the simulated wafer image of the reference mask at the different exposures;

calculating an average CD deviation for the predetermined defect-free features and the corresponding defect-free features for each exposure;

calculating the defect severity score using the average CD deviation for each exposure; and

generating the defect severity score report with the defect severity score.

2. The method of claim 1 , further including:

measuring CDs for any identified neighbor feature on the simulated wafer image of the physical mask at the different exposures;

measuring CDs for any corresponding identified neighbor feature on the simulated wafer image of the reference mask at the different exposures; and

calculating a relative CD deviation for each identified neighbor feature and the corresponding identified neighbor feature for each exposure,

wherein calculating the defect severity score includes using the relative CD deviation for each exposure.

3. The method of claim 2 , further including:

determining a maximum relative CD deviation for each exposure,

wherein calculating the defect severity score includes using the maximum relative CD deviation for each exposure.

4. The method of claim 3 , wherein the defect severity score being within a first range indicates that CD changes due to the defect are within a specified CD tolerance.

5. The method of claim 4 , wherein the defect severity score being within a second range indicates that CD changes due to the defect are larger than a specified CD tolerance, but the defect is not a severe defect.

6. The method of claim 5 , wherein the defect severity score being within a third range indicates that CD changes due to the defect are larger than a specified CD tolerance, and the defect is a severe defect.

7. The method of claim 3 , wherein the defect severity score being within a first range indicates that the physical mask should be repaired.

8. The method of claim 7 , wherein the defect severity score being within a second range indicates that the physical mask should be re-fabricated.

9. The method of claim 8 , wherein the defect severity score being within a third range indicates that the physical mask is acceptable.

10. A computer readable medium comprising computer instructions that, when run on a computer, generate signals to control process steps of:

generating a simulated wafer image of a physical mask, the physical mask including a defect;

generating a simulated wafer image of a reference mask, the reference mask corresponding to a defect-free physical mask;

computing an average critical dimension (CD) deviation for a defect-free area of the physical mask using the simulated wafer images of the physical and reference masks;

computing a maximum CD deviation for a defect area of the physical mask using the simulated wafer images of the physical and reference masks;

using the average CD deviation and the maximum CD deviation to provide printability analysis regarding the defect of the defect area; and

generating a printability report based on the printability analysis.

11. The computer readable medium of claim 10 , wherein the printability analysis includes a defect severity score for the defect, wherein the report includes the defect severity score.

12. The computer readable medium of claim 11 , wherein the defect severity score being within a first range indicates that CD changes due to the defect are within a specified CD tolerance.

13. The computer readable medium of claim 12 , wherein the defect severity score being within a second range indicates that CD changes due to the defect are larger than a specified CD tolerance, but the defect is not a severe defect.

14. The computer readable medium of claim 13 , wherein the defect severity score being within a third range indicates that CD changes due to the defect are larger than a specified CD tolerance, and the defect is a severe defect.

15. The computer readable medium of claim 11 , wherein the defect severity score being within a first range indicates that the physical mask should be repaired.

16. The computer readable medium of claim 15 , wherein the defect severity score being within a second range indicates that the physical mask should be re-fabricated.

17. The computer readable medium of claim 16 , wherein the defect severity score being within a third range indicates that the physical mask is acceptable.

18. A computer readable medium comprising computer instructions that, when run on a computer, generate signals to control process steps for generating a printability report for a physical mask, the process steps comprising:

generating a simulated wafer image of the physical mask, the physical mask including a defect;

generating a simulated wafer image of a reference mask, the reference mask corresponding to a defect-free physical mask;

identifying a first feature proximate to the defect on the simulated wafer image of the physical mask;

identifying a second feature on the simulated wafer image of the reference mask, the second feature corresponding to the first feature;

computing critical dimension (CD) deviations including the first and second features to provide printability analysis; and

generating the printability report based on the printability analysis.

19. The computer readable medium of claim 18 , wherein computing CD deviations includes computing a defect severity score for the defect, and wherein the printability report includes the defect severity score.

20. The computer readable medium of claim 19 , wherein the defect severity score being within a first range indicates that CD changes due to the defect are within a specified CD tolerance.

21. The computer readable medium of claim 20 , wherein the defect severity score being within a second range indicates that CD changes due to the defect are larger than a specified CD tolerance, but the defect is not a severe defect.

22. The computer readable medium of claim 21 , wherein the defect severity score being within a third range indicates that CD changes due to the defect are larger than a specified CD tolerance, and the defect is a severe defect.

23. The computer readable medium of claim 19 , wherein the defect severity score being within a first range indicates that the physical mask should be repaired.

24. The computer readable medium of claim 23 , wherein the defect severity score being within a second range indicates that the physical mask should be re-fabricated.

25. The computer readable medium of claim 24 , wherein the defect severity score being within a third range indicates that the physical mask is acceptable.

26. A method of generating a printability report for a physical mask, the method comprising:

using a mask inspection system,

generating a simulated wafer image of the physical mask, the physical mask including a defect;

generating a simulated wafer image of a reference mask, the reference mask corresponding to a defect-free physical mask;

computing an average critical dimension deviation for a defect-free area of the physical mask using the simulated wafer images of the physical and reference masks;

computing a maximum critical dimension deviation for a defect area of the physical mask using the simulated wafer images of the physical and reference masks;

using the average critical dimension deviation and the maximum critical dimension deviation to provide the printability analysis;

determining a defect severity score based on the step of using the average critical dimension deviation; and

generating the printability report including the defect severity score.

27. The method of claim 26 , wherein the defect severity score being within a first range indicates that CD changes due to the defect are within a specified CD tolerance.

28. The method of claim 27 , wherein the defect severity score being within a second range indicates that CD changes due to the defect are larger than a specified CD tolerance, but the defect is not a severe defect.

29. The method of claim 28 , wherein the defect severity score being within a third range indicates that CD changes due to the defect are larger than a specified CD tolerance, and the defect is a severe defect.

30. The method of claim 26 , wherein the defect severity score being within a first range indicates that the physical mask should be repaired.

31. The method of claim 30 , wherein the defect severity score being within a second range indicates that the physical mask should be re-fabricated.

32. The method of claim 31 , wherein the defect severity score being within a third range indicates that the physical mask is acceptable.

Continuity (4)
Continuation 1177068200 · Jun 28, 2007
Continuation 1104339800 · Jan 25, 2005
Continuation 0981402300 · Mar 20, 2001
Related Publication 20080260235A1 · Oct 23, 2008