Chip package and method for fabricating the same
A method for fabricating chip package includes providing a semiconductor chip with a metal bump, next adhering the semiconductor chip to a substrate using a glue material, next forming a polymer material on the substrate, on the semiconductor chip, and on the metal bump, next polishing the polymer material, next forming a patterned circuit layer over the polymer material and connected to the metal bump, and then forming a tin-containing ball over the patterned circuit layer and connected to the patterned circuit layer.
1. A method for fabricating a chip package, comprising:
providing a semiconductor chip separated from a semiconductor wafer, wherein said semiconductor chip comprises a silicon substrate, a MOS device in or over said silicon substrate, a first dielectric layer over said silicon substrate, a first metal layer over said first dielectric layer, a second metal layer over said first metal layer, a second dielectric layer between said first and second metal layers, a passivation layer over said first and second dielectric layers and over said first and second metal layers, and a metal bump connected to said second metal layer through a hole in said passivation layer, wherein said a metal bump has a thickness between 5 and 150 micrometers;
adhering said semiconductor chip to a substrate;
after said adhering said semiconductor chip to said substrate, forming a polymer material over said substrate, on said semiconductor chip and on said metal bump;
after said forming said polymer material, polishing said polymer material and uncovering a surface of said metal bump; and
after said polishing said polymer material and said uncovering said surface, forming a third metal layer over said polymer material and on said surface.
2. The method of claim 1 , wherein said substrate comprises an organic substrate.
3. The method of claim 1 , wherein said substrate comprises a metal substrate.
4. The method of claim 1 , wherein said passivation layer comprises a nitride layer having a thickness between 0.2 and 1.2 micrometers.
5. The method of claim 1 , wherein said third metal layer comprises electroplated copper.
6. The method of claim 1 , wherein said third metal layer comprises electroplated gold.
7. The method of claim 1 , wherein said metal bump is formed by a process comprising forming a fourth metal layer, followed by forming a photoresist layer on said fourth metal layer, wherein an opening in said photoresist layer exposes a region of said fourth metal layer, followed by electroplating a fifth metal layer over said region, followed by removing said photoresist layer, followed by removing said fourth metal layer not under said fifth metal layer.
8. The method of claim 1 , wherein said metal bump is formed by a process comprising forming a fourth metal layer, followed by forming a photoresist layer on said fourth metal layer, wherein an opening in said photoresist layer exposes a region of said fourth metal layer, followed by electroplating a copper layer on said region, followed by removing said photoresist layer, followed by removing said fourth metal layer not under said copper layer.
9. The method of claim 1 , after said forming said third metal layer, further comprising separating said substrate from said semiconductor chip.
10. The method of claim 1 , after said forming said third metal layer, further comprising forming a tin-containing ball over said polymer material, wherein said tin-containing ball is connected to said third metal layer.
11. The method of claim 1 , after said forming said third metal layer, further comprising cutting said polymer material.
12. The method of claim 1 , wherein said forming said third metal layer comprises an electroplating process.
13. A method for fabricating a chip package, comprising:
providing a semiconductor chip separated from a semiconductor wafer, wherein said semiconductor chip comprises a silicon substrate, a MOS device in or over said silicon substrate, a first dielectric layer over said silicon substrate, a first metal layer over said first dielectric layer, a second metal layer over said first metal layer, a second dielectric layer between said first and second metal layers, a passivation layer over said first and second dielectric layers and over said first and second metal layers, and a metal bump connected to said second metal layer through a hole in said passivation layer;
adhering said semiconductor chip to a substrate;
after said adhering said semiconductor chip to said substrate, forming a polymer material over said substrate, on said semiconductor chip and on said metal bump;
after said forming said polymer material, polishing said polymer material and uncovering a surface of said metal bump;
after said polishing said polymer material and said uncovering said surface, forming a third metal layer over said polymer material and on said surface;
after said forming said third metal layer, forming a first photoresist layer on said third metal layer, wherein a first opening in said first photoresist layer exposes a first region of said third metal layer;
after said forming said first photoresist layer, electroplating a fourth metal layer over said first region;
after said electroplating said fourth metal layer, removing said first photoresist layer; and
after said removing said first photoresist layer, removing said third metal layer not under said fourth metal layer.
14. The method of claim 13 , wherein said substrate comprises an organic substrate.
15. The method of claim 13 , wherein said passivation layer comprises a nitride layer having a thickness between 0.2 and 1.2 micrometers.
16. The method of claim 13 , wherein said metal bump is formed by a process comprising forming a fifth metal layer, followed by forming a second photoresist layer on said fifth metal layer, wherein a second opening in said second photoresist layer exposes a second region of said fifth metal layer, followed by electroplating a copper layer on said second region, followed by removing said second photoresist layer, followed by removing said fifth metal layer not under said copper layer.
17. The method of claim 13 , after said removing said third metal layer not under said fourth metal layer, further comprising cutting said polymer material.
18. The method of claim 13 , wherein said electroplating said fourth metal layer comprises electroplating a copper layer on said first region.
19. The method of claim 13 , wherein said electroplating said fourth metal layer comprises electroplating a gold layer over said first region.
20. The method of claim 13 , after said removing said third metal layer not under said fourth metal layer, further comprising separating said substrate from said semiconductor chip.