Semiconductor device assemblies and packages including multiple semiconductor device components
A multidie semiconductor device assembly or package includes an interposer comprising a substrate with at least one receptacle therethrough. A plurality of semiconductor device components (e.g., semiconductor devices) may be assembled with the interposer. For example, at least one contact pad of a semiconductor device component adjacent to one surface of the interposer may be electrically connected to a corresponding contact pad of another semiconductor device component positioned adjacent to an opposite surface of the interposer. As another example, multiple semiconductor device components may be at least partially superimposed relative to one another and at least partially disposed within a receptacle of the interposer.
1. A semiconductor device assembly, comprising:
an interposer including a substrate with an opening therethrough;
at least one semiconductor device positioned adjacent to a first surface of the interposer, at least partially over the opening, a bond pad-bearing surface of the at least one semiconductor device facing the opening, at least one bond pad of the at least one semiconductor device communicating electrically with a corresponding bond pad on the first surface of the interposer; and
at least another semiconductor device positioned adjacent to a second surface of the interposer, at least partially over the opening, a bond pad-bearing surface of the at least another semiconductor device facing the opening, at least one bond pad of the at least another semiconductor device being in electrical communication with at least one bond pad of the at least one semiconductor device by way of a discrete conductive element that extends through the opening without contacting the substrate.
2. The semiconductor device assembly of claim 1 , further comprising:
at least one discrete conductive element establishing the electrical communication between the at least one bond pad of the at least one semiconductor device and the at least one bond pad of the at least another semiconductor device.
3. The semiconductor device assembly of claim 1 , wherein the at least one bond pad of the at least one semiconductor device that communicates electrically with a corresponding bond pad on the first surface of the interposer and the at least one bond pad of the at least one semiconductor device that communicates electrically with at least one bond pad of the at least another semiconductor device are separate bond pads.
4. The semiconductor device assembly of claim 3 , further comprising:
at least one discrete conductive element between the at least one bond pad of the at least one semiconductor device that communicates electrically with a corresponding bond pad on the first surface of the interposer.
5. The semiconductor device assembly of claim 1 , wherein the at least one bond pad of the at least one semiconductor device comprises a portion of a redistribution circuit.
6. The semiconductor device assembly of claim 5 , wherein the redistribution circuit further comprises a conductive trace in electrical communication with the at least one bond pad and a redistribution bond pad at an end of the conductive trace opposite from the corresponding bond pad.
7. The semiconductor device assembly of claim 6 , wherein the redistribution bond pad is positioned adjacent to an outer periphery of the second semiconductor device.
8. A semiconductor device assembly, comprising:
an interposer with an opening therethrough;
at least two semiconductor devices in at least partially superimposed arrangement disposed at least partially within the opening; and
at least another semiconductor device positioned over a surface of the interposer, comprising:
bond pads communicating with integrated circuitry of the at least another semiconductor device, all of the bond pads being located adjacent to a peripheral edge of the at least another semiconductor device and aligned and in electrical communication with a corresponding contacts of the interposer;
at least one redistribution circuit, including:
a redistribution contact in alignment and electrical communication with at least one bond pad of a semiconductor device of the at least two semiconductor devices;
a redistribution trace including a first end in communication with the redistribution contact, the redistribution trace extending from the redistribution contact to a location adjacent to a peripheral edge of the at least another semiconductor device located over the interposer; and
a redistributed contact at a second end of the redistribution trace, aligned and in electrical communication with a corresponding contact of the interposer.
9. The semiconductor device assembly of claim 8 , wherein the at least two semiconductor devices are oriented with back sides thereof facing each other.