IP Library Granted Patent US 7,579,307
Granted Patent B2
US 7,579,307 · App. 10/579,141 · Granted Aug 25, 2009

Cleaner for semiconductor devices

Assignees: Kishimoto Sangyo Co., Ltd.; Fine Polymers Corporation
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Quick Facts
Patent No.
US 7,579,307
App. No.
10/579,141
Granted
Aug 25, 2009
Kind
B2
Abstract

The invention has for its object the provision of a cleaner capable of removing particles and metal impurities present on the surface of a wafer without corrosion of wirings, gates or the like yet at normal temperature in a short period of time and with a one-pack type solution. To accomplish the above object, the invention provides a cleaner that is an aqueous solution containing phosphoric acid, hydrofluoric acid, and ammonia and/or amine, and having a pH ranging from 2 to 12, wherein the aqueous solution comprises 0.5 to 25 mass % of phosphoric acid, 0.1 to 10 mass % of ammonia and/or amine, and 5×10 −3 to 5.0 mass % of hydrofluoric acid.

Claims (13)

1. A cleaner that is an aqueous solution containing phosphoric acid, hydrofluoric acid, and ammonia and/or amine and having a pH ranging from 2 to 6, wherein said aqueous solution contains:

0.5 to 25 mass % of phosphoric acid,

0.1 to 10 mass % of ammonia and/or amine, and

0.1 to 5.0 mass % of hydrofluoric acid.

2. The cleaner according to claim 1 , wherein the pH is regulated by phosphoric acid.

3. The cleaner according to claim 1 or 2 , which further includes a surface active agent and/or a chelate agent.

4. The cleaner according to claim 1 , which further includes hydrogen peroxide.

5. The cleaner according to claim 1 , which is used for cleaning off particles and/or metal impurities out of the surface of a semiconductor device substrate.

6. The cleaner according to claim 2 , which further includes hydrogen peroxide.

7. The cleaner according to claim 3 , which further includes hydrogen peroxide.

8. The cleaner according to claim 2 , which is used for cleaning off particles and/or metal impurities out of the surface of a semiconductor device substrate.

9. The cleaner according to claim 3 , which is used for cleaning off particles and/or metal impurities out of the surface of a semiconductor device substrate.

10. The cleaner according to claim 4 , which is used for cleaning off particles and/or metal impurities out of the surface of a semiconductor device substrate.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2010
From: KISCO LTD.
To: FINE POLYMERS CORPORATION
Reel/Frame 025105/0092 →
CHANGE OF NAME Recorded Oct 7, 2010
From: KISHIMOTO SANGYO CO., LTD.
To: KISCO LTD.
Reel/Frame 025105/0095 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 4TH ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL 018689 FRAME 0862. ASSIGNOR CONFIRMS THE ASSIGNMENT. Recorded Jan 5, 2007
From: SUGA, SHIGEMASA; KAMON, SHIGERU; YATA, TAKASHI; TERAI, AKIHIRO
To: KISHIMOTO SANGYO CO., LTD.; FINE POLYMERS CORPORATION
Reel/Frame 018729/0714 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 28, 2006
From: SUGA, SHIGEMASA; KAMON, SHIGERU; YATA, TAKASHI; TERA1, AKIHIRO
To: KISHIMOTO SANGYO CO., LTD.; FINE POLYMERS CORPORATION
Reel/Frame 018689/0862 →
Priority Claims (1)
JP 2003-394271 · Nov 25, 2003 · national
Continuity (1)
Related Publication 20070105735A1 · May 10, 2007