Pixel control element selection transfer method, pixel control device mounting device used for pixel control element selection transfer method, wiring formation method after pixel control element transfer, and planar display substrate
There is provided a method for selectively transferring pixel control devices onto a planar display substrate, which method enables prepared pixel control devices to be easily, reliably and inexpensively mounted without inducing any loss of pixel control devices. The pixel control devices ( 1 ) are formed in a large number at pitches ( 5, 6 ) obtained respectively by dividing pitches ( 105, 106 ) on the planar display substrate ( 100 ) by natural numbers. The pixel control devices corresponding to the number of the pitches ( 105, 106 ) on the planar display substrate ( 100 ) are picked up, retained on a transparent thermoplastic resin film ( 101 ) formed on the planar display substrate ( 100 ) utilizing the plastic deformation of the film and fixed at the peripheries thereof with a transparent ultraviolet curing resin film ( 104 ).
1. A method for selectively transferring onto a planar display substrate pixel control devices each controlling a plurality of pixels, comprising the steps of:
fixing a device substrate having pixel control devices for controlling the plurality of pixels onto a support substrate, each of said pixel control devices having an integrated circuit on a surface thereof;
cutting the device substrate into individual pixel control devices with the integrated circuit;
fixing the pixel control devices on the support substrate onto a pickup substrate;
holding the pixel control devices on the pickup substrate by a pickup device and transferring the pixel control devices on the pickup device onto the planar display substrate; and
forming the pixels on a surface of the planar display substrate;
wherein a plurality of pixel control devices is formed on the device substrate at a first direction array pitch px/m that is obtained by dividing an array pitch px in a first direction on the planar display substrate by a natural number m and at a second direction array pitch py/n obtained by dividing an array pitch py in a second direction on the planar display substrate that is orthogonal to the first direction by a natural number n;
wherein the pixel control devices only corresponding to the array pitches px and py of the planar display substrate are selected from the pixel control devices fixed onto the pickup substrate and then transferred onto the planar display substrate; and
wherein each of the pixel control devices controls 3 colors×4 pixels arrayed in 2 columns and 6 rows and is transferred to a center of the pixels arrayed in 2 columns and 6 rows.
2. A method for selectively transferring onto a planar display substrate pixel control devices each controlling a plurality of pixels with integrated circuits, comprising the steps of:
fixing a device substrate having pixel control devices for controlling the plurality of pixels onto a support substrate, each of said pixel control devices having an integrated circuit on a surface thereof;
fixing the device substrate on the support substrate onto a pickup substrate;
cutting the device substrate into individual pixel control devices with the integrated circuits;
holding the pixel control devices on the pickup substrate onto a pickup device and transferring the pixel control devices on the pickup device onto the planar display substrate; and
forming the pixels on a surface of the planar display substrate;
wherein a plurality of pixel control devices is formed on the device substrate at a first direction array pitch px/m that is obtained by dividing an array pitch px in a first direction on the planar display substrate by a natural number m and at a second direction array pitch py/n obtained by dividing an array pitch py in a second direction on the planar display substrate that is orthogonal to the first direction by a natural number n,
wherein the pixel control devices only corresponding to the array pitches px and py of the planar display substrate are selected from the pixel control devices fixed onto the pickup substrate and then transferred onto the planar display substrate,
wherein in the step of fixing the device substrate onto the support substrate, the integrated circuits on the device substrate are directed downward toward the support substrate, and
wherein in the step of fixing the device substrate, on the support substrate onto the pickup substrate, the device substrate is flipped so that the integrated circuits face upwardly on a side opposite to the pickup substrate.
3. The method for selectively transferring onto the planar display substrate the pixel control devices each controlling the plurality of pixels with the integrated circuits according to claim 1 , wherein in the step of fixing the device substrate onto the support substrate, the plurality of integrated circuits is directed downward toward the support substrate,
in the step of cutting the device substrate, the integrated circuit on the support substrate is cut in a condition such that the integrated circuit faces the support substrate, and
in the step of holding the pixel control devices on the support substrate onto the pickup substrate, the pixel control devices are flipped so that the integrated circuits face downwardly on a side opposite to the pickup substrate.
4. A wiring formation method after transfer of the pixel control devices for controlling a plurality of pixels, comprising the steps of:
fixing a device substrate having pixel control devices for controlling the plurality of pixels onto a support substrate, each of said pixel control devices having an integrated circuit on a surface thereof;
cutting the device substrate into individual pixel control devices with the integrated circuit;
fixing the pixel control devices on the support substrate onto a pickup substrate;
holding the pixel control devices on the pickup substrate by a pickup device and transferring the pixel control devices on the pickup device onto the planar display substrate; and
forming the pixels on a surface of the planar display substrate;
forming wirings inside the pixel control devices so that inside wirings pass through the pixel control devices; and
forming wirings on the planar display substrate by screen printing using a screen mask having a predetermined pattern corresponding to wirings connected to the inside wirings of the pixel control devices in broken-line patterns,
wherein a plurality of pixel control devices is formed on the device substrate at a first direction array pitch px/m that is obtained by dividing an array pitch px in a first direction on the planar display substrate by a natural number m and at a second direction array pitch py/n obtained by dividing an array pitch py in a second direction on the planar display substrate that is orthogonal to the first direction by a natural number n, and
the pixel control devices only corresponding to the array pitches px and py of the planar display substrate are selected from the pixel control devices fixed onto the pickup substrate and then transferred onto the planar display substrate.