IP Library › Granted Patent US 7,587,806
Granted Patent B2
US 7,587,806 · App. 12/081,878 · Granted Sep 15, 2009

Method of manufacturing an ultrasonic sensor

Assignee: Mitsumi Electric Co., Ltd.
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Quick Facts
Patent No.
US 7,587,806
App. No.
12/081,878
Granted
Sep 15, 2009
Kind
B2
Abstract

A method of manufacturing an ultrasonic sensor including a case, a piezoelectric element having first and second electrodes, and a conductive member having first and second conductive parts is disclosed. The method includes the steps of a) forming the conductive member by integrally forming the first and second conductive parts and a joining part that joins portions of the first and second conductive parts, b) mounting the piezoelectric element and the conductive member in the case so that the first conductive part is connected to the first electrode and the second conductive part is connected to the second electrode, and the joining part and the portions of the first and second conductive parts joined by the joining part are positioned outside of the case, c) supplying a filling material into the case, and d) removing the joining part after step c).

Claims (9)

1. A method of manufacturing an ultrasonic sensor including a case, a piezoelectric element having first and second electrodes, and a conductive member having first and second conductive parts, the method comprising the steps of:

a) forming the conductive member by integrally forming the first and second conductive parts and a joining part that joins portions of the first and second conductive parts;

b) mounting the piezoelectric element and the conductive member in the case so that the first conductive part is connected to the first electrode and the second conductive part is connected to the second electrode, and the joining part and the portions of the first and second conductive parts joined by the joining part are positioned outside of the case;

c) supplying a filling material into the case; and

d) removing the joining part after step c).

2. The method of manufacturing an ultrasonic sensor as claimed in claim 1 , wherein the conductive member is formed by using a cladding material.

3. The method of manufacturing an ultrasonic sensor as claimed in claim 1 , wherein the step a) includes a step of punching out the conductive member from a planar conductive material.

4. The method of manufacturing an ultrasonic sensor as claimed in claim 3 , further comprising a step of:

forming a notch part on each end of the joining part.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2008
From: FURUKAWA, KENICHI
To: MITSUMI ELECTRIC CO., LTD.
Reel/Frame 020895/0786 →
Priority Claims (1)
JP 2007-155271 · Jun 12, 2007 · national
Continuity (1)
Related Publication 20080307623A1 · Dec 18, 2008