Magnetoresistive element and magnetic memory
A magnetoresistive element includes a free layer which contains a magnetic material and has an fct crystal structure with a (001) plane oriented, the free layer having a magnetization which is perpendicular to a film plane and has a direction to be changeable by spin-polarized electrons, a first nonmagnetic layer and a second nonmagnetic layer which sandwich the free layer and have one of a tetragonal crystal structure and a cubic crystal structure, and a fixed layer which is provided on only one side of the free layer and on a surface of the first nonmagnetic layer opposite to a surface with the free layer and contains a magnetic material, the fixed layer having a magnetization which is perpendicular to a film plane and has a fixed direction.
1. A magnetoresistive element comprising:
a free layer which contains a magnetic material and has an fct (face-centered tetragonal) crystal structure with a (001) plane oriented, the free layer having a magnetization which is perpendicular to a film plane and has a direction to be changeable by spin-polarized electrons;
a first nonmagnetic layer and a second nonmagnetic layer which sandwich the free layer and have one of a tetragonal crystal structure and a cubic crystal structure; and
a fixed layer which is provided on only one side of the free layer and on a surface of the first nonmagnetic layer opposite to a surface with the free layer and contains a magnetic material, the fixed layer having a magnetization which is perpendicular to a film plane and has a fixed direction.
2. The element according to claim 1 , wherein the first nonmagnetic layer is made of one of an oxide containing at least one element selected from the group consisting of Li, Be, Na, Mg, Nb, Ti, V, Ta, and Ba, and a nitride containing at least one element selected from the group consisting of Ti and V.
3. The element according to claim 1 , wherein the second nonmagnetic layer is made of one of an oxide containing at least one element selected from the group consisting of Li, Be, Na, Mg, Nb, Ti, V, Ta, and Ba, a nitride containing at least one element selected from the group consisting of Ti and V, a carbide containing V, a hydride containing at least one element selected from the group consisting of Li and Pd, a selenide containing at least one element selected from the group consisting of Zr and Ho, and a metal or an intermetallic compound containing at least one element selected from the group consisting of Al, Au, As, Ag, Be, Ga, P, Pt, Pd, Ir, Rh, Cu, V, Cr, Nb, Mo, Ta, and W.
4. The element according to claim 1 , wherein the free layer has a thickness of not more than 10 nm.
5. The element according to claim 1 , wherein the free layer has one of an L1 0 crystal structure and an L1 2 crystal structure.
6. The element according to claim 1 , wherein the free layer contains an alloy made of at least one element selected from the group consisting of Fe, Co, Ni, Mn, and Cr, and at least one element selected from the group consisting of Pt, Pd, Rh, Au, Hg, and Al.
7. The element according to claim 6 , wherein the free layer includes an intermediate layer which is inserted therein and made of a nonmagnetic material.
8. The element according to claim 6 , wherein the free layer contains at least one element selected from the group consisting of Be, Mn, Cu, Sm, Au, Nd, Ag, Pr, La, Ca, Yb, Eu, Ce, Sr, Ba, Al, Mg, Zn, Pb, Cd, Sn, and In.
9. The element according to claim 6 , wherein the free layer contains at least one element selected from the group consisting of Sn, Sb, Pb, and Bi.
10. The element according to claim 6 , wherein the free layer contains at least one element selected from the group consisting of Li, Na, K, Be, Mg, Ca, and Sc.
11. The element according to claim 6 , wherein the free layer contains at least one element selected from the group consisting of B and C.
12. The element according to claim 1 , wherein
the free layer contains, as a main component, an alloy made of at least one first element selected from the group consisting of Fe, Co, Ni, Mn, and Cr and at least one second element selected from the group consisting of Pt, Pd, Rh, Au, Hg, and Al,
a composition ratio of the first element and the second element is set within a range of 40 to 60 atomic %, and
an oxygen content of the alloy is not more than 1%.
13. The element according to claim 1 , wherein
the free layer contains, as a main component, an alloy made of at least one first element selected from the group consisting of Fe, Co, Ni, Mn, and Cr and at least one second element selected from the group consisting of Pt, Pd, Rh, Au, Hg, and Al,
a content of the first element is smaller than that of the second element, and
an oxygen content of the alloy is not less than 10%.
14. A magnetoresistive element comprising:
a free layer which contains a magnetic material and has an fct crystal structure with a (001) plane oriented, the free layer having a magnetization which is perpendicular to a film plane and has a direction to be changeable by spin-polarized electrons;
a first nonmagnetic layer and a second nonmagnetic layer which sandwich the free layer and have one of a tetragonal crystal structure and a cubic crystal structure;
a first fixed layer which is provided on a surface of the first nonmagnetic layer opposite to a surface with the free layer and contains a magnetic material, the first fixed layer having a magnetization which is perpendicular to a film plane and has a fixed direction; and
a second fixed layer which is provided on a surface of the second nonmagnetic layer opposite to a surface with the free layer and contains a magnetic material, the second fixed layer having a magnetization which is perpendicular to a film plane and has a fixed direction,
wherein the first nonmagnetic layer has a resistance value different from that of the second nonmagnetic layer.
15. The element according to claim 14 , wherein the first nonmagnetic layer is made of one of an oxide containing at least one element selected from the group consisting of Li, Be, Na, Mg, Nb, Ti, V, Ta, and Ba, and a nitride containing at least one element selected from the group consisting of Ti and V.
16. The element according to claim 14 , wherein the second nonmagnetic layer is made of one of an oxide containing at least one element selected from the group consisting of Li, Be, Na, Mg, Nb, Ti, V, Ta, and Ba, a nitride containing at least one element selected from the group consisting of Ti and V, a carbide containing V, a hydride containing at least one element selected from the group consisting of Li and Pd, a selenide containing at least one element selected from the group consisting of Zr and Ho, and a metal containing at least one element selected from the group consisting of Au, Ag, and Cu.
17. The element according to claim 14 , wherein the free layer has a thickness of not more than 10 nm.
18. The element according to claim 14 , wherein the free layer has one of an L1 0 crystal structure and an L1 2 crystal structure.
19. The element according to claim 14 , wherein the free layer contains an alloy made of at least one element selected from the group consisting of Fe, Co, Ni, Mn, and Cr, and at least one element selected from the group consisting of Pt, Pd, Rh, Au, Hg, and Al.
20. The element according to claim 19 , wherein the free layer includes an intermediate layer which is inserted therein and made of a nonmagnetic material.
21. A magnetic memory comprising a memory cell including a magnetoresistive element, and a first electrode and a second electrode which sandwich the magnetoresistive element and through which a current is supplied to the magnetoresistive element,
the magnetoresistive element including:
a free layer which contains a magnetic material and has an fct crystal structure with a (001) plane oriented, the free layer having a magnetization which is perpendicular to a film plane and has a direction to be changeable by spin-polarized electrons;
a first nonmagnetic layer and a second nonmagnetic layer which sandwich the free layer and have one of a tetragonal crystal structure and a cubic crystal structure; and
a fixed layer which is provided on only one side of the free layer and on a surface of the first nonmagnetic layer opposite to a surface with the free layer and contains a magnetic material, the fixed layer having a magnetization which is perpendicular to a film plane and has a fixed direction.
22. The memory according to claim 21 , further comprising a write circuit which bidirectionally supplies the current to the magnetoresistive element through the first electrode and the second electrode.
23. The memory according to claim 22 , wherein the memory cell includes a selection transistor electrically connected between the write circuit and the second electrode.