IP Library › Granted Patent US 7,627,212
Granted Patent B2
US 7,627,212 · App. 12/181,448 · Granted Dec 1, 2009

Optical integrated device

Assignee: Fujitsu Limited
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Quick Facts
Patent No.
US 7,627,212
App. No.
12/181,448
Granted
Dec 1, 2009
Kind
B2
Abstract

An optical integrated device includes an optical waveguide structure formed on a semiconductor substrate and including a plurality of first channel optical waveguide portions, an optical coupler portion and a second channel optical waveguide portion, a burying layer formed from a semi-insulating semiconductor material and burying the optical waveguide structure therein such that an upper portion thereof forms a flat face and a side portion thereof forms an inclined face having a predetermined angle with respect to the semiconductor substrate, and a plurality of dummy structure bodies provided over a desired region in the proximity of at least an output side of the optical coupler portion so that radiation light from the optical coupler portion is spatially separated from signal light propagating along the second channel optical waveguide portion. The plural dummy structure bodies are provided discretely so as to be buried flat by the burying layer.

Claims (16)

1. An optical integrated device, comprising:

an optical waveguide structure formed on a semiconductor substrate and including a plurality of first channel optical waveguide portions, an optical coupler portion and a second channel optical waveguide portion connected to said plural first channel optical waveguide portions through said optical coupler portion;

a plurality of dummy structure bodies being discretely provided over a desired region in the proximity of at least an output side of said optical coupler portion;

a semi-insulating semiconductor burying layer formed from a semi-insulating semiconductor material and formed around said optical waveguide structure and said dummy structure bodies such that an upper portion thereof forms a flat face having a predetermined width and a side portion thereof forms an inclined face having a predetermined angle with respect to said semiconductor substrate; and

a waveguide, formed from said semi-insulating semiconductor burying layer formed around said plurality of dummy structure bodies, guiding radiation light from said optical coupler portion toward a face other than an output end face outputting signal light which propagates along said first channel optical waveguide portions or said second channel optical waveguide portions.

2. The optical integrated device as claimed in claim 1 , wherein said dummy structure bodies are provided such that the inclined face of said semi-insulating semiconductor burying layer is formed at a position spaced by a desired distance from a proximity of at least the output side of said optical coupler portion.

3. The optical integrated device as claimed in claim 1 , wherein said dummy structure bodies are provided over a region from a proximity of said optical coupler portion to a proximity of a side face of said semiconductor substrate.

4. The optical integrated device as claimed in claim 1 , wherein said plural dummy structure bodies are provided in a region wherein radiation lights from said optical coupler portion output, the radiation lights being separated from signal lights inputted individually from said plural first channel optical waveguide portions to said optical coupler portion.

5. The optical integrated device as claimed in claim 1 , wherein said dummy structure bodies are disposed such that the distance between adjacent ones of said dummy structure bodies is approximately 10 μm to approximately 50 μm.

6. The optical integrated device as claimed in claim 1 , wherein said dummy structure bodies are formed in a columnar shape.

7. The optical integrated device as claimed in claim 6 , wherein said dummy structure bodies have a diameter substantially equal to or less than a width of said first channel optical waveguide portions or said second channel optical waveguide portion.

8. The optical integrated device as claimed in claim 1 , wherein said dummy structure bodies have a layer structure same as that of said optical waveguide structure.

9. The optical integrated device as claimed in claim 1 , wherein said dummy structure bodies is formed partly or entirely from a semiconductor material having a characteristic of absorbing the radiation light.

10. The optical integrated device as claimed in claim 1 , wherein the semi-insulating semiconductor material is doped with an element forming a deep impurity level.

11. The optical integrated device as claimed in claim 1 , wherein said plural first channel optical waveguide portions individually include a semiconductor optical amplifier having an electrode provided on a surface thereof, and a semiconductor optical amplifier gate array is formed from the plural semiconductor optical amplifiers.

12. The optical integrated device as claimed in claim 11 , wherein said second channel optical waveguide portion includes a semiconductor optical amplifier.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2008
From: TANAKA, SHINSUKE; TAKABAYASHI, KAZUMASA; UETAKE, AYAHITO
To: FUJITSU LIMITED
Reel/Frame 021329/0380 →
Priority Claims (1)
JP 2007-218880 · Aug 24, 2007 · national
Continuity (1)
Related Publication 20090052834A1 · Feb 26, 2009