Methods of packaging microelectronic imaging devices
Microelectronic imaging devices and methods of packaging microelectronic imaging devices are disclosed herein. In one embodiment, the microelectronic imaging devices include an interposer substrate and a plurality of imager units coupled to the interposer substrate. The interposer substrate includes a plurality of openings and a plurality of contact arrays proximate to corresponding openings. The individual imager units include a microelectronic die with an image sensor and a plurality of bond-pads electrically coupled to the image sensor. The image sensors are aligned with corresponding openings on the interposer substrate, and the bond-pads are electrically coupled to corresponding contacts on the interposer substrate.
1. A method of packaging a plurality of imagers, comprising:
providing an interposer substrate, wherein the interposer substrate has a plurality of openings through the substrate, a plurality of interior contact arrays positioned proximate to corresponding openings, and a plurality of exterior contacts positioned between adjacent interior contact arrays, each exterior contact being electrically connected to a plurality of interior contacts;
providing a plurality of imagers with the individual imagers including a microelectronic die having an image sensor, an optics unit positioned to transmit a particular spectrum of radiation to the image sensor, and a plurality of bond-pads electrically coupled to the image sensor; and
attaching the imagers to the interposer substrate with the image sensors aligned with corresponding openings, the optics units positioned at least partially within the corresponding opening, and the bond-pads electrically coupled to corresponding interior contacts.
2. The method of claim 1 wherein:
the interposer substrate further includes a first side and a second side opposite the first side, with the interior contact arrays on the second side;
the individual microelectronic dies further include a first side and a second side opposite the first side, with the image sensor and bond-pads on the first side; and
attaching the imagers to the interposer substrate comprises coupling the imagers to the substrate with the first side of the microelectronic dies facing toward the second side of the interposer substrate.
3. The method of claim 1 wherein providing the imagers further comprises:
attaching a plurality of spacers to corresponding microelectronic dies between the image sensor and the bond-pads so that individual spacers are outboard corresponding image sensors and the corresponding bond-pads are outboard the individual spacers; and
attaching a plurality of covers to corresponding spacers.
4. The method of claim 1 wherein:
the microelectronic dies further include a first end and a second end opposite the first end; and
attaching the imagers to the interposer substrate comprises attaching the imagers to the substrate so that the interior contacts are positioned between the first and second ends of the corresponding microelectronic die.
5. The method of claim 1 wherein attaching the imagers to the interposer substrate comprises electrically coupling the bond-pads to corresponding interior contacts without wire-bonds.
6. The method of claim 1 wherein:
attaching the imagers to the interposer substrate comprises coupling the bond-pads directly to the corresponding interior contacts; and
the method further comprises reflowing the contacts to bond the interior contacts to the corresponding bond-pads.
7. A method of packaging a plurality of imagers, comprising:
providing an interposer substrate, wherein the interposer substrate has a plurality of openings through the substrate, a plurality of interior contact arrays positioned proximate to corresponding openings, and a plurality of exterior contacts positioned between adjacent interior contact arrays, each exterior contact being electrically connected to at least one interior contact, wherein the interior contacts and exterior contacts are on a same side of the interposer substrate;
providing a plurality of imagers with the individual imagers including a microelectronic die having an image sensor, an optics unit positioned in alignment with the image sensor, and a plurality of bond-pads electrically coupled to the image sensor; and
attaching the imagers to the interposer substrate with the image sensors aligned with corresponding openings, the optics units positioned at least partially within the corresponding opening, and the bond-pads electrically coupled to corresponding interior contacts.
8. The method of claim 1 wherein:
the interposer substrate further includes a first side and a second side opposite the first side, with the interior contact arrays on the second side and with the exterior contacts on the first side;
the individual microelectronic dies further include a first side and a second side opposite the first side, with the image sensor and bond-pads on the first side; and
attaching the imagers to the interposer substrate comprises coupling the imagers to the substrate with the first side of the microelectronic dies facing toward the second side of the interposer substrate.
9. The method of claim 7 wherein:
the interposer substrate further includes a first side and a second side opposite the first side, with the interior contact arrays and the external contacts on the second side;
the individual microelectronic dies further include a first side and a second side opposite the first side, with the image sensor and bond-pads on the first side; and
attaching the imagers to the interposer substrate comprises coupling the imagers to the substrate with the first side of the microelectronic dies facing toward the second side of the interposer substrate.