Acoustic transducer module
A module ( 100, 200, 300, 400, 500, 600, 900 ) may be electrically connected to a PCB ( 18, 918 ) residing in a device ( 14 ) or may be joined to the device ( 14 ) to form a portion of the housing ( 16, 916 ) of the device ( 14 ). The module may include a housing ( 102, 202, 302, 402, 502, 602 ) having at least one layer, a surface mountable component, such as a surface mountable acoustic transducer ( 110, 210, 310, 410, 510, 610, 910 ) having a connecting surface ( 114, 214, 314, 414, 514, 614, 914 ), and at least one acoustic port ( 124, 224, 324, 424, 524, 624, 924 ) to couple a surface of the surface mountable acoustic transducer to the exterior of the device ( 14 ). The module ( 100, 200, 300, 400, 500, 600, 900 ) may further include a secondary mounting structure ( 654 ) electrically connected to the connecting surface ( 114, 214, 314, 414, 514, 614, 914 ) of the surface mountable acoustic transducer ( 110, 210, 310, 410, 510, 610, 910 ). The acoustic port ( 124, 224, 324, 424, 524, 624, 924 ) may include a layer of an environmental barrier ( 450, 550 ).
1. An electronic device comprising:
a transducer;
a printed circuit board having a first surface and a second surface;
an electronic device housing having a cavity and a sound aperture for permitting the cavity to communicate with an exterior of the cavity, the transducer disposed in the cavity; and
an acoustic pathway penetrating the first surface to the second surface to permit the transducer to communicate with the exterior of the cavity;
wherein the first surface of the printed circuit board is attached to the transducer and forms a portion of the transducer; and wherein the second surface of the printed circuit board is attached to the electronic device housing and forms a portion of the electronic device housing.
2. The electronic device of claim 1 , further comprising a structure surrounding the acoustic pathway, the structure forming a portion of the transducer.
3. The electronic device of claim 2 , wherein the structure is an environmental barrier configured to constrain moisture and debris from entry into the sound aperture.
4. The electronic device of claim 2 , wherein the structure is an acoustic seal for preventing leakage of acoustic waves from the acoustic pathway to the exterior of the cavity.
5. An electronic device comprising:
a transducer having a transducer housing;
a printed circuit board having a first surface and a second surface; and
an electronic device housing having a cavity and a sound aperture to permit the cavity to communicate with an exterior of the cavity, the transducer disposed in the cavity;
wherein the first surface of the printed circuit board is attached to the transducer and forms a portion of the transducer, and wherein the transducer housing forming a portion of the electronic device housing and allowing acoustic waves to communicate with the transducer via the sound aperture, and the electronic device housing is formed on the first surface of the printed circuit.
6. The electronic device of claim 5 , further comprising an acoustic pathway penetrating the first surface to the second surface of the printed circuit board for permitting the transducer to communicate with the exterior of the cavity.
7. The electronic device of claim 6 , further comprising a structure surrounding the acoustic pathway, the structure forming a portion of the transducer.
8. The electronic device of claim 7 , wherein the structure is an environmental barrier configured to constrain moisture and debris from entry into the sound aperture.
9. The electronic device of claim 7 , wherein the structure is an acoustic seal for preventing leakage of acoustic waves from the acoustic pathway to the exterior of the cavity.