Smart memory alloy control
The invention relates to a method for improving performance and life of a material adapted to contract when heated to a critical temperature such as shape memory alloy wire (SMA). The method includes the steps of measuring ambient temperature before activation, measuring voltage applied to the SMA wire and/or current flowing in the SMA wire, calculating power and energy required to heat the material from the ambient to the critical temperature and providing the calculated power and energy.
1. A method for improving performance and life of a shape memory alloy material adapted to contract when heated to a critical temperature; the method including the following steps:
(i) measuring ambient temperature before activation;
(ii) measuring voltage applied to the material and/or current flowing in the material;
(iii) calculating power and/or energy required to heat the material from the ambient to the critical temperature; and
(iv) providing the calculated power and/or energy;
wherein in step (iii) the power when calculated is calculated according to the formula:
PWM Compensated =PWM Nominal ×(Voltage Nominal ) 2 /(Voltage Loaded ) 2
where:
Voltage Nominal is nominal power supply voltage value
PWM is pulse width modulation; and
the energy when calculated is calculated according to the formula:
PWM Compensated =PWM Nominal ×(Temp Activation −Temp Ambient )/(Temp Activation −Temp Nominal )
where:
Temp Nominal is nominal temperature and is set to 25° C.
Temp Activation is the critical temperature at which the material is adapted to contract and is set to 95° C.
PWM is pulse width modulation.
2. The method of claim 1 wherein in step (iii) both power and energy are calculated.
3. The method of claim 1 , when used in connection with a fastening system.
4. The method of claim 1 , when used in connection with a fastening system which includes at least one sensor monitoring mechanism.
5. The method of claim 1 , wherein in step (iii) energy is calculated and provided via a microprocessor.
6. The method of claim 2 , which includes the step of the microprocessor sensing or reporting, or sensing and reporting, state of the fastening system.