IP Library Granted Patent US 7,642,038
Granted Patent B2
US 7,642,038 · App. 11/085,274 · Granted Jan 5, 2010

Method for forming pattern, thin film transistor, display device, method for manufacturing thereof, and television apparatus

Assignee: Semiconductor Energy Laboratory Co., Ltd.
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Quick Facts
Patent No.
US 7,642,038
App. No.
11/085,274
Granted
Jan 5, 2010
Kind
B2
Abstract

To provide a display device which can be manufactured with higher efficiency in the use of material through a simplified manufacturing process, and a method for manufacturing the display device. Another object is to provide a technique by which patterns of a wiring the like which constitutes the display device can be formed to a desired shape with good control. In a method for forming a pattern according to the present invention, a mask is formed over a light-transmitting substrate; a first region including a photocatalyst is formed over the substrate and the mask; the photocatalyst is irradiated with light through the substrate to modify a part of the first region; a second region is formed; and a composition containing a pattern forming material is discharged to the second region, thus, a pattern is formed. The mask does not transmit light.

Claims (42)

1. A method for forming a pattern, comprising the steps of:

forming a mask over a light-transmitting substrate;

forming a first region including a photocatalyst over the light-transmitting substrate and the mask;

forming a material containing a fluorocarbon chain over the photocatalyst;

irradiating the photocatalyst and the material containing the fluorocarbon chain with light through the light-transmitting substrate to modify a part of a surface of the material containing the fluorocarbon chain which is to be a second region; and

discharging a conductive composition containing a pattern forming material to the second region to form a pattern,

wherein the mask does not transmit the light.

2. A method according to claim 1 , wherein titanium oxide is used as the photocatalyst to form the first region.

3. A method according to claim 1 , wherein a surface of the material containing the fluorocarbon chain is modified so that the second region has higher wettability with the composition than the first region.

4. A method for manufacturing a thin film transistor, comprising the steps of:

forming a first conductive layer over a light-transmitting substrate;

forming an insulating layer over the light-transmitting substrate and the first conductive layer;

forming a first region including a photocatalyst over the insulating layer;

forming a material containing a fluorocarbon chain over the photocatalyst;

irradiating the photocatalyst and the material containing the fluorocarbon chain with light through the light-transmitting substrate to modify a part of a surface of the material containing the fluorocarbon chain which is to be a second region; and

discharging a composition containing a conductive material to the second region to form a second conductive layer,

wherein the first conductive layer does not transmit light.

5. A method according to claim 4 , wherein titanium oxide is used as the photocatalyst to form the first region.

6. A method according to claim 4 , wherein a surface of the material containing the fluorocarbon chain is modified so that the second region has higher wettability with the composition than the first region.

7. A method according to claim 4 , wherein the first conductive layer is formed as a gate electrode layer and the second conductive layer is formed as a source electrode layer and a drain electrode layer.

8. A method for forming a pattern, comprising the steps of:

forming a mask over a light-transmitting substrate;

forming a first region including a photocatalyst over the light-transmitting substrate and the mask;

forming a material containing a fluorocarbon chain over the photocatalyst;

irradiating the photocatalyst and the material containing the fluorocarbon chain with light through the light-transmitting substrate to modify a part of a surface of the material containing the fluorocarbon chain which is to be a second region;

discharging a conductive composition containing a pattern forming material to the second region to form a pattern; and

removing a part of the first region including the photocatalyst and a part of the material containing the fluorocarbon chain,

wherein the mask does not transmit the light.

9. A method according to claim 8 , wherein titanium oxide is used as the photocatalyst to form the first region.

10. A method according to claim 8 , wherein a surface of the material containing the fluorocarbon chain is modified so that the second region has higher wettability with the composition than the first region.

11. A method for manufacturing a thin film transistor, comprising the steps of:

forming a first conductive layer over a light-transmitting substrate;

forming an insulating layer over the light-transmitting substrate and the first conductive layer;

forming a first region including a photocatalyst over the insulating layer;

forming a material containing a fluorocarbon chain over the photocatalyst;

irradiating the photocatalyst and the material containing the fluorocarbon chain with light through the light-transmitting substrate to modify a part of a surface of the material containing the fluorocarbon chain which is to be a second region;

discharging a composition containing a conductive material to the second region to form a second conductive layer; and

removing a part of the first region including the photocatalyst and a part of the material containing the fluorocarbon chain,

wherein the first conductive layer does not transmit light.

12. A method according to claim 11 , wherein titanium oxide is used as the photocatalyst to form the first region.

13. A method according to claim 11 , wherein a surface of the material containing the fluorocarbon chain is modified so that the second region has higher wettability with the composition than the first region.

14. A method according to claim 11 , wherein the first conductive layer is formed as a gate electrode layer and the second conductive layer is formed as a source electrode layer and a drain electrode layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2005
From: FUJII, GEN
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 016711/0293 →
Priority Claims (1)
JP 2004-088068 · Mar 24, 2004 · national
Continuity (1)
Related Publication 20050221203A1 · Oct 6, 2005