Dual direction rake piezo actuator
Methods and apparatus relating to use and/or provision of a rake piezo actuator are described. In one embodiment, a piezo patch may be coupled to a plurality of blades (e.g., to cause the blades to oscillate and provide air flow between fins of one or more heat sinks). Other embodiments are also described.
1. An apparatus comprising:
a plurality of blades; and
a piezo patch coupled to the plurality of blades,
wherein the piezo patch causes the plurality of blades to oscillate in response to an alternating current and wherein the plurality of blades have a rake shape to allow the blades to be inserted between fins of a heatsink.
2. The apparatus of claim 1 , wherein a first portion of the plurality of blades is coupled to a first side of the piezo patch and a second portion of the plurality of blades is coupled to a second side of the piezo patch.
3. The apparatus of claim 2 , wherein the first side and the second side of the piezo patch are directly opposing sides.
4. The apparatus of claim 1 , wherein at least one of the plurality of blades is to be extended: (a) in a plane parallel to a base of the heat sink and (b) between at least two fins of the heat sink, wherein the at least two fins of the heatsink are to protrude in a plane that is perpendicular to the based of the heatsink.
5. The apparatus of claim 1 , wherein the alternating current causes the blades to oscillate to generate and air flow between the fins of the heatsink.
6. The apparatus of claim 1 , wherein the plurality of blades are on at least two different sides of the piezo patch.
7. The apparatus of claim 6 , wherein an oscillation of the plurality of blades generates an air flow between fins of at least two heatsinks.
8. The apparatus of claim 1 , further comprising a first heatsink coupled to a processor and a second heatsink coupled to a chipset, wherein an oscillation of the plurality of blades generates an air flow between fins of the first and second heatsinks to cool the processor and the chipset.
9. The apparatus of claim 8 , wherein the processor comprises a plurality of cores.
10. The apparatus of claim 1 , wherein, in response to the alternating current, the piezo patch is to change its shape to cause lateral vibration in the plurality of blades.
11. A method comprising:
coupling a plurality of blades to two opposing sides of a piezo patch; and
coupling the piezo patch to a semiconductor package, wherein the plurality of blades have a rake shape to allow the blades to be inserted between fins of a heatsink.
12. The method of claim 11 , further comprising the piezo patch changing its shape in response to an alternating current.
13. The method of claim 12 , further comprising oscillating the plurality of blades in response to the changing shape of the piezo material.
14. The method of claim 11 , further comprising electrically coupling the piezo patch to the semiconductor package.
15. The method of claim 11 , further comprising aligning the plurality of blades with one or more heatsinks.
16. The method of claim 15 , further comprising coupling the one or more heatsinks to one or more integrated circuit devices.
17. The method of claim 11 , further comprising extending at least one of the plurality of blades: (a) in a plane parallel to a base of the heat sink and (b) between at least two fins of the heat sink, wherein the at least two fins of the heatsink are to protrude in a plane that is perpendicular to the based of the heatsink.