Laser processing device, laser processing temperature measuring device, laser processing method and laser processing temperature measuring method
The object is to provide a laser processing apparatus, a laser processing temperature measuring apparatus, a laser processing method, and a laser processing temperature measuring method which can highly accurately detect the processing temperature when carrying out processing such as welding with laser light. A laser processing apparatus 1 A for processing members. DR, UR to be processed by irradiating the members with laser light LB comprises a laser (semiconductor laser unit 20 A) for generating the laser light LB; optical means for converging the laser light LB generated by the laser onto processing areas DA, UA; and a filter 30 , disposed between the members DR, UR to be processed and the optical means, for blocking a wavelength of fluorescence generated by the optical means upon pumping with the laser light LB; wherein light having the wavelength blocked by the filter 30 is used for measuring a temperature of the processing areas DA, UA.
1. A laser processing apparatus for welding stacked resin members to each other by using laser light, the apparatus comprising:
a semiconductor laser for generating laser light; and
a filter, disposed between the semiconductor laser and the resin members, for blocking light having a wavelength that is other than an oscillation wavelength of the semiconductor laser wherein said blocked light becomes an observation wavelength for measuring a temperature of a welding area in the light generated by the semiconductor laser;
one of the stacked resin members, on the incident side of the laser light generated by the semiconductor laser, having a property of transmitting the laser light that is generated by the semiconductor laser and the thermally radiating light that is generated by the welding area;
the filter blocks the light that is generated by the semiconductor laser and that has a wavelength other than an oscillation wavelength of the semiconductor laser, and said light having a wavelength falling within the range of 1500 nm to 2800 nm which can be transmitted through the resin member on the incident side of the laser light;
wherein the light that is generated by the semiconductor laser and has a wavelength that cannot be blocked by the filter is used for welding the resin members to each other, and said thermally radiating light that is generated by the welding area and has a wavelength that does not pass through said filter, said thermally radiating light is used for measuring the temperature of the welding area.
2. A laser processing apparatus for welding stacked resin members to each other by using laser light, the apparatus comprising:
a semiconductor laser for generating laser light; and
optical means for converging the laser light generated by the semiconductor laser onto a welding area and blocking light having a wavelength that is other than an oscillation wavelength of the semiconductor laser wherein said blocked light becomes an observation wavelength for measuring a temperature of the welding area in the light generated by the semiconductor laser;
one of the stacked resin members, on the incident side of the laser light generated by the semiconductor laser, having a property of transmitting the laser light that is generated by the semiconductor laser and the thermally radiating light that is generated by the welding area;
optical means blocks the light that is generated by the semiconductor laser and that has a wavelength other than an oscillation wavelength of the semiconductor laser, and said light having a wavelength falling within the range of 1500 nm to 2800 nm which can be transmitted through the resin member on the incident side of the laser light;
wherein the light that is generated by the semiconductor laser and has a wavelength that cannot be blocked by optical means is used for welding the resin members to each other, and said thermally radiating light that is generated by the welding area and has a wavelength that does not pass through said optical means, said thermally radiating light is used for measuring the temperature of the welding area.
3. A laser processing method for welding stacked resin members to each other by using laser light, the method comprising:
a laser light generating step of causing a semiconductor laser to generate laser light; and
a filtering step of blocking light having a wavelength that is other than an oscillation wavelength of the semiconductor laser wherein said blocked light becomes an observation wavelength for measuring a temperature of a welding area in the light generated by the laser light generating step with a filter before welding;
one of the stacked resin members, on the incident side of the laser light generated by the laser light generating step, having a property of transmitting the laser light that is generated by the laser light generating step and the thermally radiating light that is generated by the welding area;
the filtering step blocks the light that is generated by the laser light generating step and that has a wavelength other than an oscillation wavelength of the semiconductor laser, and said light having a wavelength falling within the range of 1500 nm to 2800 nm which can be transmitted through the resin member on the incident side of the laser light;
wherein the light that is generated by the laser light generating step and has a wavelength that cannot be blocked by the filtering step is used for welding the resin members to each other, and said thermally radiating light that is generated by the welding area and has a wavelength that does not pass through said filtering step, said thermally radiating light is used for measuring the temperature of the welding area.
4. A laser processing method for welding stacked resin members to each other by using laser light, the method comprising:
a laser light generating step of causing a semiconductor laser to generate laser light; and
a filtering step of blocking light having a wavelength that is other than an oscillation wavelength of the semiconductor laser wherein said blocked light becomes an observation wavelength for measuring a temperature of a welding area in the light generated by the laser light generating step with an optical system adapted to converge the laser light generated by the laser light generating step onto the welding area;
one of the stacked resin members, on the incident side of the laser light generated by the laser light generating step, having a property of transmitting the laser light that is generated by the laser light generating step and the thermally radiating light that is generated by the welding area;
the filtering step blocks the light that is generated by the laser light generating step and that has a wavelength other than an oscillation wavelength of the semiconductor laser, and said light having a wavelength falling within the range of 1500 nm to 2800 nm which can be transmitted through the resin member on the incident side of the laser light;
wherein the light that is generated by the laser light generating step and has a wavelength that cannot be blocked by the filtering step is used for welding the resin members to each other, and said thermally radiating light that is generated by the welding area and has a wavelength that does not pass through said filtering step, said thermally radiating light is used for measuring the temperature of the welding area.