Liquid cooled laser bar arrays incorporating diamond/copper expansion matched materials
A laser diode array having a plurality of diode bars bonded by a hard solder to expansion matched spacers and mounted on a gas or liquid cooled heatsink. The spacers are formed of a material such as copper/diamond composite material having a thermal expansion that closely matches that of the laser bars.
1. A laser bar array having a plurality of laser bars sandwiched between spacer material, and mounted by soldered to a substrate, wherein the spacer material is formed of a material having a thermal expansion that closely matches that of the laser bars, and wherein the spacer material is formed of a copper/diamond composite material, and the substrate includes an inlet hole and an outlet hole for passing a coolant through the substrate;
Wherein the diamond/composite material comprises 30-50 volume percent diamond and the balance comprises primary copper;
Wherein the diamond particles have a maximum size of 500 microns.
2. The laser bar array of claim 1 , wherein the diamond/copper composite material comprises 35-45 volume percent diamond and the balance comprises primarily copper.
3. The laser bar array of claim 1 , wherein the diamond/copper composite material comprises 38-42 volume percent diamond and the balance comprises primarily copper.
4. The laser bar array of claim 1 , wherein the diamond particles are relatively uniform in size.
5. The laser bar array of claim 4 , wherein the diamond particles have a maximum size of 200 microns.
6. The laser bar array of claim 4 , wherein the diamond particles have a maximum size of about 100 microns.
7. The laser bar array of claim 1 , wherein the diamond particles are coated with a material selected from the group consisting of Cr, W, Mo, Co, Ti, Si, SiC, TiN, TiC, Ta and Zr.
8. The laser bar array of claim 1 , wherein the solder comprises a hard, high temperature solder.
9. The laser bar array of claim 8 , wherein the solder comprises a gold/tin hard, high temperature solder.
10. The laser bar array of claim 8 , wherein the solder comprises a hard, high temperature gold/germanium solder.
11. The laser bar array of claim 1 , wherein the laser bars are aligned end to end on the substrate.
12. The laser bar array of claim 1 , wherein the laser bars are aligned parallel to one another on the substrate.
13. The laser bar array of claim 1 , wherein the coolant comprises a gas.
14. The laser bar array of claim 1 , wherein the coolant comprises a liquid.