Polishing composition
A polishing composition comprising an abrasive and water, wherein the polishing composition has an index of degree of sedimentation of 80 or more and 100 or less; a process for producing a substrate comprising polishing a substrate to be polished using the above-mentioned composition; a process for preventing clogging of a polishing pad comprising applying the above-mentioned composition; a process for preventing clogging of a polishing pad comprising applying the above-mentioned composition to polishing with a polishing pad for a nickel-containing object to be polished; and a process for preventing clogging of a polishing pad comprising applying a composition comprising a hydrophilic polymer having two or more hydrophilic groups in its molecule and a molecular weight of 300 or more, or a compound capable of dissolving nickel hydroxide at a pH of 8.0, and water to polishing with a polishing pad for a nickel-containing object to be polished.
1. A process for producing a magnetic disk substrate comprising the step of polishing a magnetic disk substrate to be polished with a polishing composition comprising
an abrasive which comprises α-alumina particles,
water and
a hydrophilic polymer compound selected from the group consisting of a copolymer of diisobutylene and maleic acid and a sulfonic acid-modified polyacrylic acid,
wherein the polishing composition has a pH of from 2 to 7 and an index of degree of sedimentation of 80 or more and 100 or less.
2. The process according to claim 1 , wherein the content of the hydrophilic polymer compound is from 0.001 to 1.5% by weight of the polishing composition.
3. The process according to claim 1 , wherein the polishing composition further comprises:
compound group (A): one or more compounds selected from the group consisting of carboxylic acids having 2 to 20 carbon atoms and having either OH group or groups or SH group or groups, monocarboxylic acids having 1 to 20 carbon atoms, dicarboxylic acids having 2 to 3 carbon atoms, and salts thereof and/or
compound group (B): one or more compounds selected from the group consisting of polycarboxylic acids having 4 or more carbon atoms and having neither OH group or groups nor SH group or groups, aminocarboxylic acids, amino acids, and salts thereof.
4. The process according to claim 3 , wherein the total amount of the compound group (A) is from 0.01 to 5% by weight of the polishing composition, and the total content of the compound group (B) is from 0.01 to 10% by weight of the polishing composition.
5. The process according to claim 1 , wherein the α-alumina particles have an average primary particle size of from 0.01 to 1 μm.
6. The process according to claim 1 , wherein the α-alumina particles have an average secondary particle size of from 0.1 to 1.2 μm.
7. The process according to claim 1 , wherein the content of the abrasive is from 1 to 40% by weight of the polishing composition.
8. The process according to claim 1 , wherein the abrasive further comprises intermediate alumina particles.
9. The process according to claim 8 , wherein the polishing composition contains an alumina sol and the total content of the intermediate alumina and the alumina sol in the polishing composition is from 1 to 100 parts by weight, based on 100 parts by weight of the abrasive excluding the intermediate alumina and the alumina sol.