IP Library Granted Patent US 7,675,027
Granted Patent B2
US 7,675,027 · App. 11/984,557 · Granted Mar 9, 2010

Motion-detecting module

Assignee: Lite-On Semiconductor Corp.
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Quick Facts
Patent No.
US 7,675,027
App. No.
11/984,557
Granted
Mar 9, 2010
Kind
B2
Abstract

A motion-detecting module includes a PCB, a light-emitting unit, and a light-sensing unit. The light-emitting unit is electrically disposed over the PCB. The light-sensing unit has a light-sensing die electrically disposed on the PCB and a package cover covered on the light-sensing die, and the package cover has a through hole corresponding to the light-sensing die and a transparent element disposed in the through hole. The present invention does not need extra package protection body of the prior art for protecting the light-sensing die during the transport of the light-sensing module. The present invention use original package cover to prevent the light-sensing die from being damaged by external force, and the original package cover shelters the light-sensing die from extra stray light.

Claims (10)

1. A motion-detecting module, comprising:

a PCB;

a light-emitting unit electrically disposed over the PCB, the light-emitting unit includes a light-emitting die mounted to the PCB and electrically coupled thereto by a pair of leads, the light-emitting die and pair of leads being encapsulated by a material having a contour to form a lens; and

a light-sensing unit having a light-sensing die electrically disposed on the PCB and a package cover covered on the light-sensing die, wherein the package cover has a through hole corresponding to the light-sensing die, a transparent element disposed in the through hole and an imaging lens overlaying the hole.

2. The motion-detecting module as claimed in claim 1 , wherein the light-emitting die provides a coherent illumination.

3. The motion-detecting module as claimed in claim 1 , wherein the package cover is opaque.

4. The motion-detecting module as claimed in claim 1 , wherein the transparent element is selected from the group consisting of a transparent glass and a transparent colloid.

5. The motion-detecting module as claimed in claim 4 , wherein the transparent colloid is formed of a material selected from the group consisting of an epoxy composition and an acrylic material.

6. The motion-detecting module as claimed in claim 1 , wherein the imaging lens is formed of a material selected from the group consisting of an epoxy composition and an acrylic material.

7. The motion-detecting module as claimed in claim 1 , wherein the light-emitting die provides an incoherent illumination.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2015
From: LITE-ON SEMICONDUCTOR CORP.
To: DYNA IMAGE CORPORATION
Reel/Frame 035117/0665 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 8, 2008
From: CHENG, CHIA-CHU; LEE, YA-LUN; LU, YU-WEI
To: LITE-ON SEMICONDUCTOR CORP.
Reel/Frame 020337/0122 →
Priority Claims (1)
TW 95220558 U · Nov 22, 2006 · national
Continuity (1)
Related Publication 20080116357A1 · May 22, 2008