IP Library Granted Patent US 7,675,124
Granted Patent B2
US 7,675,124 · App. 11/361,248 · Granted Mar 9, 2010

Memory array structure with strapping cells

Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
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Quick Facts
Patent No.
US 7,675,124
App. No.
11/361,248
Granted
Mar 9, 2010
Kind
B2
Abstract

A memory array with a row of strapping cells is provided. In accordance with embodiments of the present invention, strapping cells are positioned between two rows of a memory array. The strapping cells provide a P+ strap between N+ active areas of two memory cells in a column and provide an N+ strap between P+ active areas of two memory cells in a column of the memory array. The strapping cells provide an insulating structure between the two rows of the memory array and create a more uniform operation of the memory cells regardless of the positions of the memory cells within the memory array. In an embodiment, a dummy N-well may be formed along the outer edge of the memory array in a direction perpendicular to the row of strapping cells. Furthermore, transistors may be formed in the strapping cells to provide additional insulation between the strapped memory cells.

Claims (31)

1. A memory device comprising:

a first memory cell and a second memory cell, each memory cell having at least two N-type active areas and a P-type active area interposed between the N-type active areas; and

a strapping cell between the first memory cell and the second memory cell, wherein the strapping cell has at least two P-type straps and at least one N-type strap, one of the P-type straps connecting one of the N-type active areas of the first memory cell to one of N-type active areas of the second memory cell, another one of the P-type straps connecting another one of the N-type active areas of the first memory cell to another one of the N-type active areas of the second memory cell, and the N-type strap connecting the respective P-type active areas of the first memory cell and the second memory cell.

2. A memory device comprising:

a first row of memory cells;

a second row of memory cells;

a row of strapping cells substantially parallel to a word line, wherein each strapping cell has a first strap of a first conductivity type that substantially abuts active regions of a second conductivity type in respective memory cells of the first row and the second row; and

dummy gate layers overlying the first strap, thereby forming dummy transistors in one or more of the strapping cells;

wherein the first strap is in a first well having the first conductivity type, the first strap extending to a border of the first well.

3. The memory device of claim 2 , wherein a drain node of the dummy transistors is electrically coupled to V ss or a memory cell bit line, wherein a source node and a gate of the dummy transistors are electrically coupled to a P-well strapping layer, the P-well strapping layer being electrically coupled to V ss .

4. The memory device of claim 2 , wherein a drain node of the dummy transistors is electrically coupled to V ss or a memory cell bit line, wherein a source node and a gate of the dummy transistors are electrically coupled to a P-well strapping layer, the P-well strapping layer being electrically coupled to a bias voltage.

5. The memory device of claim 2 , wherein a drain node of the dummy transistors is electrically coupled to V cc wherein a source node and a gate of the dummy transistors are electrically coupled to an N-well strapping layer, the N-well strapping layer being electrically coupled to V cc .

6. The memory device of claim 2 , wherein a drain node of the dummy transistors is electrically coupled to V cc , wherein a source node and a gate of the dummy transistors are electrically coupled to an N-well strapping layer, the N-well strapping layer being electrically coupled to a voltage source different than V cc .

7. The memory device of claim 2 , wherein each strapping cell further comprises a second strap of the first conductivity type electrically connecting second active areas of the second conductivity type in adjacent memory cells.

8. The memory device of claim 7 , further comprising one or more dummy conductive lines electrically coupling a plurality of the first straps, a plurality of the second straps, or one or more of the first straps and second straps.

9. The memory device of claim 7 , further comprising at least two sequential transistors formed in each of the first straps and second straps.

10. The memory device of claim 9 , wherein gates of the transistors are electrically coupled to a node between the transistors.

11. The memory device of claim 2 , further comprising a dummy N-well formed adjacent a well along an edge of the first and second row of memory cells.

12. The memory device of claim 2 , wherein the first well is electrically coupled to V cc , a predetermined voltage, or floating.

13. The memory device of claim 2 , wherein the memory device is an SRAM.

14. A memory device comprising:

a first row of memory cells electrically coupled to a first word line;

a second row of memory cells electrically coupled to a second word line; and

a row of strapping cells, wherein each strapping cell has a first region of an N-type conductivity that substantially abuts active regions of a P-type conductivity in respective memory cells of the first row and the second row, the first region being located in an N-well and extending to a border of the N-well.

15. The memory device of claim 14 , wherein each strapping cell further comprises a second region of the P-type conductivity and that substantially abuts active regions of the N-type conductivity in respective memory cells of the first row and the second row.

16. The memory device of claim 15 , further comprising one or more dummy conductive lines electrically coupling a plurality of the first regions, a plurality of the second regions, or one or more of the first regions and second regions.

17. The memory device of claim 15 , further comprising at least two sequential transistors formed in each first region and second region.

18. The memory device of claim 17 , wherein gates of the transistors are electrically coupled to a node between the transistors.

19. The memory device of claim 14 , further comprising a dummy well formed adjacent a well along an edge of an array of memory cells.

20. The memory device of claim 19 , wherein the dummy well is a dummy N-well that is electrically coupled to V cc .

21. The memory device of claim 19 , wherein the dummy well is a dummy N-well that is electrically floating.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2006
From: LIAW, JHON-JHY
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 017622/0610 →
Continuity (1)
Related Publication 20070200182A1 · Aug 30, 2007