System and method for depositing thin layers on non-planar substrates by stamping
View Patent ↗An elastomeric stamp is used to deposit material on a non-planar substrate. A vacuum mold is used to deform the elastomeric stamp and pressure is applied to transfer material from the stamp to the substrate. By decreasing the vacuum applied by the vacuum mold, the elasticity of the stamp may be used to apply this pressure. Pressure also may be applied by applying a force to the substrate and/or the stamp. The use of an elastomeric stamp allows for patterned layers to be deposited on a non-planar substrate with reduced chance of damage to the patterned layer.
1. A method for depositing a solid material on a non-planar substrate, comprising:
coating a surface of an elastomeric stamp with the material to be deposited;
applying a vacuum to a vacuum mold to which the elastomeric stamp is hermetically sealed to deform the elastomeric stamp;
placing the non-planar substrate over the coated, deformed elastomeric stamp;
transferring the material from the elastomeric stamp to the non-planar substrate by applying a force between the coated, deformed elastomeric stamp and the non-planar substrate and after transferring the material, removing the elastomeric stamp from a deposited layer.
2. The method of claim 1 , wherein at least one surface of the non-planar substrate has two-dimensional curvature.
3. The method of claim 1 , wherein the surface of the elastomeric stamp is coated with the material to be deposited while the stamp is in a planar configuration.
4. The method of claim 1 , wherein the surface of the elastomeric stamp is coated with the material to be deposited while the stamp is in a non-planar configuration.
5. The method of claim 1 , wherein the force is applied by reducing the vacuum applied to the vacuum mold while the non-planar substrate is held at a constant position relative to the vacuum mold, until the stamp surface is in conformal contact with the substrate such that the elasticity of the stamp causes the stamp to exert a pressure on the non-planar substrate.
6. The method of claim 1 , wherein the vacuum mold has a non-planar surface and the elastomeric stamp deforms to contour the non-planar surface when the vacuum is applied to the vacuum mold.
7. The method of claim 6 , wherein the force is applied by pressing the non-planar substrate against the elastomeric stamp while the elastomeric stamp is in contact with the non-planar surface of the vacuum mold, such that the elastomeric stamp is compressed between the non-planar substrate and the non-planar surface of the vacuum mold.
8. The method of claim 1 , wherein the non-planar substrate is semi-spherical and subtends an angle of 60°-120°.
9. The method of claim 1 , wherein the non-planar substrate is continuously curved, and the ratio of the maximum height of the non-planar substrate to the major axis of the non-planar substrate is at least 0.1.
10. The method of claim 1 , wherein applying the force between the coated, deformed elastomeric stamp and the non-planar substrate causes the material to cold weld to the substrate.
11. The method of claim 1 , wherein transferring the material from the elastomeric stamp to the non-planar substrate further comprises at least one of: applying heat; utilizing self-assembled monolayer spreading; initiating an oxidation reaction; initiating a chemical reaction; and applying ultraviolet light.
12. The method of claim 1 , further comprising applying a vacuum to the vacuum mold to remove the elastomeric stamp from a deposited layer.
13. The method of claim 1 , wherein the material to be deposited is a metal.
14. The method of claim 1 , wherein the elastomeric stamp is patterned with raised features extending 5 nm to 3 μm from the base of the stamp.
15. The method of claim 1 , further comprising applying a plasma oxidation process to the substrate, the elastomeric stamp, or both before the force is applied.