Mold for resin molding, resin molding apparatus, and semiconductor device manufacture method
A mold includes a pot for accommodating resin, a cavity for accommodating a semiconductor chip to be resin-molded and a runner as a resin passage for transporting the resin accommodated in the pot to the cavity. A foreign matter retention pocket is disposed which is a recess formed by digging further a partial inner surface of the runner. A runner magnet attracts and attaches a metallic foreign matter contained in fluid transported in the runner to the inner surface of the foreign matter retention pocket.
1. A mold for resin molding comprising:
a pot for accommodating resin;
a cavity for accommodating a resin molding target;
a runner for transporting the resin accommodated in the pot to the cavity;
a foreign matter retention pocket disposed at a bottom of the runner and being a recess; and
a first magnet disposed at a position below a bottom surface of the foreign matter retention pocket.
2. The mold for resin molding according to claim 1 , wherein a meshed member is disposed at the runner and magnetized by the first magnet.
3. The mold for resin molding according to claim 1 , further comprising:
a plunger for applying a pressure to the resin accommodated in the pot to inject the resin into the cavity; and
a second magnet disposed in the plunger at a position corresponding to the resin.
4. A mold for resin molding comprising:
a pot for accommodating resin;
a cavity for accommodating a resin molding target;
a runner for transporting the resin accommodated in the pot to the cavity;
a foreign matter retention pocket disposed in the runner near the pot; and
an ejector pin disposed in the cavity, wherein at least a projection portion of the ejector pin in the cavity is magnetized.
5. The mold for resin molding according to claim 4 , further comprising:
a first magnet disposed at the foreign matter retention pocket.